Wafers Process Polishing
Final polishing is done with a mirror finish! It is made using a machine that uses Dublin.
We would like to introduce our wafer process "Polishing" in semiconductor manufacturing. Final polishing removes fine defects remaining on the wafer surface and provides a mirror finish on the surface where the chip will be mounted. The Dublin rotary union controls the pressure and temperature of the polishing process. Please feel free to contact us if you have any inquiries. 【Features】 ■ Removes fine defects remaining on the wafer surface ■ Provides a mirror finish on the surface where the chip will be mounted ■ Controls the pressure and temperature of the polishing process *For more details, please refer to the related links or feel free to contact us.
- Company:デュブリン・ジャパン・リミテッド 本社
- Price:Other