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Solder Reflow Oven - List of Manufacturers, Suppliers, Companies and Products

Solder Reflow Oven Product List

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Tabletop Solder Reflow Oven TRF-95

Tabletop Solder Reflow Oven TRF-95

The world's smallest class reflow oven (TRF-95) is finally on sale! ~ A compact reflow oven for easy and convenient use in labs or at home ~

Compared to conventional commercial products, we have achieved significant miniaturization, weight reduction, and low cost! Anyone can easily reflow cream solder on a wiring board anywhere and in a short time. The original product introduced by Taisei Co., Ltd., the tabletop reflow furnace, features: - A compact size that is less than half that of conventional products! - The ability to observe solder melting through glass! - Suppression of flux and solder splatter outside the furnace! We also accept custom sizes to fit your hot plate. Please feel free to contact us.

  • Reflow Equipment

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Vacuum Solder Reflow Oven HVR Series

Vacuum Solder Reflow Oven HVR Series

This is an inline vacuum solder reflow furnace compatible with voidless flux-free technology.

Recently, with the evolution of power semiconductors and advanced packaging, high-quality solder joints are in demand. Therefore, void (bubble) suppression and flux-free solder reflow have become essential. The HVR series can reduce the void rate to less than 1% by evacuating the chamber, allowing voids to escape from the molten solder. Additionally, by using formic acid as a reducing gas, it supports flux-free soldering. A feature of the HVR series is that the solder reflow process (reduction, solder melting, cooling) is continuously processed in a single chamber, and product transport is fully automated by robots. This concept enables inline product input and retrieval, improving productivity by connecting units. We have a demonstration unit available, so if you would like to see the actual machine or request a solder joint demonstration, please feel free to contact us.

  • Soldering Equipment

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Centrosarm Vacuum Solder Reflow Oven

Centrosarm Vacuum Solder Reflow Oven

This is a batch-type vacuum reflow furnace compatible with voidless and fluxless reflow. We offer a variety of lineups that support everything from development to mass production.

In conventional atmospheric reflow, there are approximately 20% void areas remaining in the solder, which leads to a deterioration in joint strength. The batch-type vacuum reflow furnace "c.VACUNITE series" from Centrolsam (Germany) can reduce the void areas to less than 2% by using vacuum. Additionally, it can accommodate fluxless reflow by using 100% hydrogen or reducing effect gases such as formic acid. As an option, it also supports plasma cleaning of the bonding surface using MW plasma.

  • Reflow Equipment

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