精電舎電子工業 Product Lineup

This product is a laser processing machine that performs scribing, cutting (full cut), and drilling on substrates such as alumina ceramic (Al2O3), aluminum nitride (AlN), and silicon nitride (Si3N4). It can also be used for flat processing of various materials other than ceramics. We are flexible in accommodating requests for ancillary equipment such as work transport devices (handler devices) and customization. 【Features】 ■ Minimal stress on the workpiece Since processing is done without contact with the workpiece, the occurrence of microcracks is suppressed, minimizing mechanical stress. ■ Reduced maintenance effort Due to non-contact processing, there is no need for tool wear or maintenance. ■ Ideal for small-batch production of various types With NC programming, it can accommodate various processing trajectories, making it ideal for sites that perform small-batch production of diverse types. ■ Capable of processing various shapes with one machine One machine can handle a wide range of processing, including scribing, full cutting, and drilling. *For more details, please refer to the external link page or feel free to contact us.

It is widely used for drilling and cutting processes on large and complex-shaped resin molded products such as doors, bumpers, and fenders, and we offer a lineup of multiple products based on differences in output. 【Features】 ■ High versatility when combined with multi-joint robots ■ Capable of 3D processing of large molded products ■ No need for tool wear or management due to non-contact processing ■ Clean cutting surfaces achieved through laser processing ■ No generation of chips ■ Safety design compliant with JIS C 6802 *For more details, please refer to the external link page or feel free to contact us.

The "UPL Series" is a nanosecond short pulse laser, which minimizes thermal effects. Depending on the processing requirements, you can freely choose from three types of pulse waveforms (long pulse, short pulse with tail, short pulse without tail). By shortening the pulse width to nanoseconds, it achieves processing that minimizes the HAZ (heat-affected zone) of the laser irradiation area. 【Features】 ■ The wavelength is 10.6μm, which has a high absorption rate for moisture and resins, enabling efficient processing. ■ Compact design that integrates the oscillator, drive circuit, and cooling mechanism. ■ Stable supply and comprehensive service system due to development, design, and manufacturing in Japan. ■ Pulse waveforms can be selected from long pulse, short pulse with tail, and short pulse without tail. ■ Energy-saving design that achieves high efficiency. *For more details, please refer to the external link page or feel free to contact us.

[Test Equipment (Construction Method)] - Ultrasonic Welding - Ultrasonic Cutter - Ultrasonic Metal Joining - High-Frequency Welder - Electromagnetic Induction Welder - Laser Welding - Laser Cutting - Impulse Welder - Non-Contact Hot Plate Welding - Hood Cutting etc.

This document introduces the diverse welding technologies developed over many years by Seidensha Electronics Co., Ltd. It explains the principles of ultrasonic vibration, the basic structure of ultrasonic welding machines, welding examples, as well as the principles of high-frequency induction heating and the basic structure of high-frequency welders. Our proud welding and processing technologies using ultrasound, high frequency, and laser have been adopted in many industries and sectors. 【Contents (excerpt)】 ■1. Our technologies are used in various everyday situations ■2. Ultrasonic application technologies ■3. High-frequency application technologies ■4. Laser application technologies ■5. Thermal application technologies *For more details, please refer to the PDF document or feel free to contact us.

This document introduces the diverse welding technologies developed over many years by Seidensha Electronic Industries Co., Ltd. It explains the principles of ultrasonic vibration, the basic structure of ultrasonic welding machines, welding examples, as well as the principles of high-frequency induction heating and the basic structure of high-frequency welders. Our proud welding and processing technologies using ultrasonic, high-frequency, and laser have been adopted in many industries and sectors. Additionally, we will be exhibiting at the 8th "Adhesive and Joining EXPO (Osaka)" held at Intex Osaka. We sincerely look forward to your visit. 【Contents】 ■1. Our technologies are used in various everyday situations ■2. Ultrasonic application technologies ■3. High-frequency application technologies ■4. Laser application technologies ■5. Thermal application technologies ■6. Various welding machines using our welding technology ■7. Wave application technologies and plastics *For more details, please refer to the PDF document or feel free to contact us.