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  1. Home
  2. Testing, Analysis and Measurement
  3. ユーシー・ジャパン
Testing, Analysis and Measurement
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ユーシー・ジャパン

addressKanagawa/Kohoku-ku, Yokohama-shi/4th Floor, Shin-Yokohama Urban Square, 1-3-1 Shin-Yokohama
phone045-470-3747
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last updated:Oct 28, 2022
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  • Products/Services(58)
  • catalog(27)
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ユーシー・ジャパン Company Profile

Creating the future with ultrasonic technology! Ultrasonic metal joining, ultrasonic powder screening, ultrasonic plastic welding, ultrasonic cutting—feel free to consult us about anything.

UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.

Business Activities

<U.C. Division> Design, development, and sales of ultrasonic transducers for ultrasonic bonding Design, development, and sales of ultrasonic oscillators for ultrasonic bonding Sales of ultrasonic bonder-related equipment Sales of semiconductor manufacturing and inspection equipment Sales of ultrasonic metal bonding machines <Rinco Division> Manufacturing and sales of ultrasonic plastic welding machines <Artec Division> Manufacturing and sales of ultrasonic powder sieving machines We have established a wide range of support systems, including experimental responses, loaning of demo machines, and ultrasonic consulting.

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Products/Services (58)

Ultrasonic powder sieve, 2-day free demo machine rental campaign! Download the manual! product image
Ultrasonic powder sieve, 2-day free demo machine rental campaign! Download the manual!
High-frequency cleaning unit: Example of use - Stripping cleaning product image
High-frequency cleaning unit: Example of use - Stripping cleaning
High-frequency cleaning unit: Application example - Semiconductor manufacturing process product image
High-frequency cleaning unit: Application example - Semiconductor manufacturing process
Small Solvent Cleaning Device 'AL1010' product image
Small Solvent Cleaning Device 'AL1010'

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catalog(27)

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Ultrasonic Powder Sifter Demo Machine Rental Service with Instruction Manual

Ultrasonic Powder Sifter Demo Machine Rental Service with Instruction Manual

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Small Solvent Cleaning Device 'AL1010'

Small Solvent Cleaning Device 'AL1010'

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【Data】Hydrocarbon Cleaning System

【Data】Hydrocarbon Cleaning System

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UCG Japan's Ultrasonic Equipment Comprehensive Catalog

UCG Japan's Ultrasonic Equipment Comprehensive Catalog

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news(6)

IPROS06870639508937809166.jpg

Notice of Participation in the "Secondary Battery Exhibition" from March 15 (Wednesday) to March 17 (Friday), 2023.

  • SEMINAR_EVENT

Our company will be exhibiting at the "Secondary Battery Exhibition" held at Tokyo Big Sight. This exhibition showcases various technologies, components, materials, and equipment necessary for the research, development, and manufacturing of secondary batteries, attracting experts from around the world. At UC Japan, we plan to exhibit our high-precision, high-rigidity servo press, the "Ultrasonic Metal Welder (USDB20kHz/35kHz)," which is focused on processing reproducibility. This product features servo load and ultrasonic control that can minimize plastic deformation during aluminum material joining, making it suitable for busbar joining, wire harnesses, terminal joining, splicers, and coil terminal joining, adapting to the recent trend of aluminum use. We sincerely look forward to your visit.

Feb 01, 2023

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We will be exhibiting at the 2022 International Powder Technology Exhibition Tokyo from December 7 (Wednesday) to December 9 (Friday).

  • SEMINAR_EVENT

UC Japan will be exhibiting at the "2022 International Powder Technology Exhibition Tokyo" held at Tokyo Big Sight (Halls 1, 2, and 3) from December 7 (Wednesday) to December 9 (Friday), 2022. At our booth, we will primarily introduce the "Ultrasonic Sieve Unit." This product transmits special ultrasonic vibrations through each individual stainless steel mesh wire to resolve issues such as clogging, adhesion, agglomeration, and bridging in sieves and hoppers. ■ Booth number: To be updated regularly. We sincerely look forward to your visit.

Feb 07, 2022

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We will be exhibiting at the 2021 International Powder Technology Exhibition Osaka from October 13 (Wednesday) to October 15 (Friday), 2021.

  • SEMINAR_EVENT

This time, UC Japan will be exhibiting at the "2021 International Powder Technology Exhibition Osaka," which will be held for three days from October 13 (Wednesday) to 15 (Friday) at Intex Osaka (Halls 4 and 5). At our booth, we will mainly introduce the "Ultrasonic Sieve Unit." This product transmits special ultrasonic vibrations to each individual stainless steel mesh wire, resolving issues such as clogging, adhesion, agglomeration, and bridging in sieves and hoppers. ■ Booth Number: 5-B01 We sincerely look forward to your visit.

Sep 09, 2021

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Detailed information

Company name ユーシー・ジャパン
Contact addresspostalcode 222-0033 Kanagawa/ Kohoku-ku, Yokohama-shi/ 4th Floor, Shin-Yokohama Urban Square, 1-3-1 Shin-YokohamaView on map TEL:045-470-3747 FAX:045-470-3748
Industry Testing, Analysis and Measurement
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