TOYO corporation List of Products and Services

"Magic Resin Carrier" is a new type of carrier that securely adheres to the substrate. It is ideal for transporting flexible substrates and thin substrates, such as FPC mounting, COF mounting, TCP mounting, and thin PWB.

The "magnesium transport carrier" is made of magnesium alloy, which has superior thermal conductivity compared to aluminum.

With the θ-free (theta-free) flow carrier that can be resized and customized, you can set the optimal conditions (angles) by adjusting the θ-free (changing the angle).

Productivity will improve through the consolidated flow!

We offer a variety of specifications, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.

Various specifications are available, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.

We offer a variety of specifications, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjust carrier specifications, and specifications with angle adjustment functions!

Various specifications are available, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.

We offer a variety of specifications, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.

We offer a variety of specifications, including fine processing specifications, parts, specifications with substrate holding functions, bridge killer specifications, and adjustable carrier specifications, among others. This is a dip pallet processed using a super high heat-resistant material called CDM. - After inserting the parts, set them on the carrier. ↓ - Solder will only attach to the opening of the carrier. ↓ - Soldering is complete. 【Features】 ■ Can accommodate cases requiring fine processing. ■ Equipped with spring pins for parts and substrate holding, allowing for smooth substrate setup and reducing time costs. ■ Ideal as an item when bridges cannot be eliminated. ■ Multiple substrates can be set and fed into the flow layer. No need for flow line width adjustment, making changeovers smooth. ■ With angle adjustment functionality, it can be adjusted to optimal soldering conditions. It rotates 360 degrees, allowing for condition setting with a single carrier. *For more details, please download the catalog or feel free to contact us.

Various specifications are available, including micro-machining specifications, parts, specifications with substrate holding functions, bridge killer specifications, adjustable carrier specifications, and specifications with angle adjustment functions.

The "CDM-ESD" is a product that demonstrates high performance in high-temperature environments above 300°C. It can also be used as a processing material for mechatronic components. "CDM" is a composite material made of glass fibers and resin structures with high mechanical resistance values. It was developed as a raw material for rapid and accurate substrate insertion jigs. 【Features】 ■ Electrostatic countermeasure material - Surface resistance value: 10^5 to 10^9 Ω/□ ■ Low deformability ■ High dimensional stability ■ Excellent solvent resistance ■ Not subject to RoHS directive *For more details, please refer to the PDF document or feel free to contact us.

The "Magnesium Carrier" enables ultra-high precision machining through NC cutting and is suitable for high-density mounting. By pulling the substrate with a tension mechanism and fixing it to the carrier, it also has the effect of correcting warping. By installing a removal jig, the substrate pulling mechanism is pushed back, allowing for removal without applying stress to the substrate. (It can also be used during substrate installation.) 【Features】 ■ The bottom surface has no R or taper shape, preventing play in components and substrates. ■ Burrs and machining warping are minimized, allowing for high-precision printing. ■ With a heat absorption and dissipation characteristic 1.3 times that of aluminum, temperature management in the reflow oven is easy. ■ Compared to other metals, it minimizes warping and shape changes due to thermal cycling. ■ Excellent durability. *For more details, please refer to the PDF document or feel free to contact us.

The "Magnesium Alloy EX Palette" is made of magnesium alloy, making it a product with superior thermal conductivity compared to aluminum. It is suitable as a jig for aligning chip components or for thin substrates. Orders can be placed starting from one piece. 【Features】 ■ Ideal for mounting flexible and thin substrates (ultra-high precision machining possible with NC cutting) ■ Minimal warping and distortion during processing, allowing for high-precision printing ■ Easy temperature management in reflow ovens (1.3 times the heat absorption and dissipation characteristics compared to aluminum) ■ No warping or shape changes due to thermal cycles, providing excellent durability *For more details, please refer to the PDF document or feel free to contact us.

The "Electronic Component Mounting Related Product Catalog" is a catalog from Toyo Corporation that addresses various needs in the electronics product process. It features a wide range of products, including the "Flex Kairun Mask," which significantly reduces solder bleeding and solder wicking, enabling excellent printing, as well as "Flow Carrier," "Thermocouple Connector," and "DYNA Squeegee." [Contents] ■ Metal Masks ■ Transport Jigs and Tools ■ Consumables ■ Squeegees ■ Screen Mesh *For more details, please refer to the PDF document or feel free to contact us.

In the semiconductor manufacturing industry, the durability of substrate transport and fixtures under high-temperature conditions in the manufacturing process is crucial. In particular, resistance to thermal deformation and chemical agents significantly affects product quality and production efficiency. CDM-ESD demonstrates high performance even in high-temperature environments above 300°C and possesses excellent chemical resistance. This enables stable operation as pallets and fixtures for substrate transport in semiconductor manufacturing. 【Usage Scenarios】 - Substrate transport in high-temperature environments - Fixtures requiring chemical resistance - Fixtures where dimensional stability is important 【Benefits of Implementation】 - High durability in high-temperature environments - Improved product quality due to excellent chemical resistance - Increased yield due to high dimensional stability