テクノアルファ Company Profile

Business Activities

In the electronics business, we import and sell semiconductor manufacturing equipment used in the latter stages of power semiconductor manufacturing processes, as well as materials for electronics manufacturers, small equipment for research and development for universities and research institutes, and procurement and sales of components, materials, and devices related to liquid crystal displays. Additionally, we are engaged in the development of products tailored to customer requests and collaboration with universities for industry-academia partnerships. ◆Main Products Wire bonders, bond testers, reflow equipment, X-ray inspection equipment, sintering equipment, electrical characteristic testing systems for power devices, plasma equipment, die bonders, flip chip bonders, conductive adhesives, temperature data loggers, wedge tools. In the marine business, we procure equipment for ships from domestic manufacturers and sell it to domestic and overseas shipyards and the Japan Coast Guard. In the environmental equipment business, we import devices aimed at the separation and concentration of liquids in industries such as food, chemicals, and petrochemicals based on sales agency agreements with overseas manufacturers, and sell them to domestic customers. Furthermore, in both businesses, we develop our own products based on customer requests and handle products that we commission to cooperative factories for manufacturing and then sell. ◆Main Products Special deck equipment for ships, marine cranes.

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Sintering is a die attach technology that uses high pressure and high temperature. AMX's X-sintering is a patented sintering press device that reduces maintenance and equipment downtime. The most distinctive feature of AMX's sintering device is the patented micro-punch press tool. This tool can make contact with all mounted components on the substrate and is capable of sintering dies of different heights and various shapes of substrates. Additionally, the micro-punch press tool is highly flexible and can accommodate any distance between dies without limitation. This sintering technology allows for the total pressure applied to the die to be perfectly traced. 【Features】 ◆ Capable of contacting all mounted components on the substrate ◆ Can sinter dies of different heights and various shapes of substrates ◆ Highly flexible, accommodating any distance between dies ◆ Perfectly traces the total pressure applied to the die