MARUWA List of Products and Services

MARUWA's ceramic valves are designed to accommodate sliding components other than valves, thanks to their excellent surface polishing technology that enhances sliding properties. They possess strength and wear resistance second only to diamonds, along with outstanding chemical resistance that is not affected by acids or alkalis. Ceramic application products produced using unique materials and molding methods achieve high performance and high reliability, thanks to years of accumulated dry press ceramic technology.

• valve

MARUWA's ferrite magnets are ferrite-based magnets characterized by high magnetic retention, widely used for communication devices, motors, suction applications, relays, and various sensors. At MARUWA, ferrite magnets are produced in a consistent process from material to magnetization. They are primarily used in automotive products and magnetic medical products, as well as in various sensors.

• magnet

Dielectric ceramics can enable miniaturization of devices and improve the implementation density of microwave integrated circuits, and are widely used in base stations for mobile communications such as mobile phones, as well as in microwave filters and circuit boards. Customization is possible according to size, shape, and other requirements. They are used for car navigation systems, antennas for mobile phones, and Bluetooth. Circuit boards for GPS antennas for car navigation systems are manufactured in sizes of 25mm square and 20mm square. Circuit boards for GPS antennas for mobile phones are produced in sizes of 9 to 12mm square. Circuit boards for isolator capacitors are available in a 50mm square size with various materials.

• Ceramics

It is used for base stations of mobile phones, satellite communications, etc. We can accommodate both TE modes that require high Q values and TM modes that can be miniaturized. Using our accumulated molding and processing technology, we can also manufacture complex shapes.

• Ceramics

Dielectric ceramics can enable miniaturization of devices and improve the implementation density of microwave integrated circuits, and are widely used in base stations for mobile communications such as mobile phones, as well as in microwave filters and circuit boards. Customization is possible according to size, shape, and other requirements. They are used in band-pass filters (BPF) and voltage-controlled oscillators (VCO). High dry pressing molding technology and high-precision processing technology achieve stable frequencies.

• Ceramics

Due to the layered structure, free wiring routing is possible. Additionally, CAVTY structure is also possible, allowing for complex configurations.

• Printed Circuit Board

Due to its layered structure, free wiring routing is possible. Additionally, cavity structures can be implemented to accommodate complex designs. It is a package made of high thermal conductivity AlN material that allows for the dissipation of heat when high-heat-generating chips are mounted.

• Printed Circuit Board

Thick-film metallized substrates are substrate materials created from the fusion of various proven ceramic materials and the thick-film metallization technology developed over many years. They can be customized using a variety of pattern formation techniques and are used in applications such as semiconductor lasers and medical lasers.

• Printed Circuit Board

This is a substrate printed with thick-film circuits using alumina and aluminum nitride substrates that excel in thermal conductivity and fired at high temperatures. The surface allows for the formation of electrodes, enabling the realization of compact and multifunctional substrates. Additionally, the via structure allows for conductivity between the front and back sides.

• Printed Circuit Board

In recent years, devices related to electronic equipment have been strongly demanded to be applicable in high vacuum environments, as well as to be fine and highly precise. Consequently, the materials used in products are being transitioned from resins and glass to ceramics in response to the need for improved quality. Our ceramic hermetic terminals use ceramics (such as Al2O3) as insulating and hermetic materials, maintaining hermeticity in high vacuum environments, alleviating concerns about aging degradation, and enhancing applicability and reliability in high-temperature environments. As a result, they are widely used in equipment and facilities in fields such as space, medical, and nuclear power, where high vacuum and high pressure compatibility is particularly required.

• Ceramics

The thermally conductive filler developed by applying the technology cultivated with ceramic substrates maximally utilizes the inherent material properties of aluminum nitride (AlN) and is expected to improve the characteristics of resin products with high stability and high thermal conductivity through a consistent manufacturing process of high-quality materials and products. It is used in thermal interface materials (TIM) such as thermal grease and thermal pads, coating materials for metal substrates, and encapsulants for semiconductors, among others.

• Ceramics

Silicon nitride products developed using ceramic material technology are used in applications such as power semiconductor substrates due to their high strength, high toughness, and high thermal conductivity, making them suitable materials for high reliability requirements.

• Printed Circuit Board

Aluminum nitride products developed using ceramic materials technology possess excellent thermal conductivity, high electrical insulation, and characteristics such as thermal expansion similar to silicon, making them noteworthy as materials for high thermal conductivity substrates. They are used in power transistor module substrates, LED mount substrates, and IC packages.

• Printed Circuit Board

It is a glazed substrate with an alkaline, lead-free amorphous glass applied to the surface of the alumina substrate, offering excellent surface smoothness and durability. It is used in thermal print heads and similar applications.

• Printed Circuit Board

MARUWA Corporation can develop semiconductor ceramic substrates from raw materials, allowing us to meet a wide variety of requests from upstream to downstream processes, including plain substrates, laminations, and circuit formation. Our alumina substrates (ceramic substrates) have a low porosity due to fine particles, providing an excellent surface condition in terms of smoothness and flatness, as well as superior adhesion to thick and thin film materials. They exhibit minimal dimensional variation in shape and thickness, with low warping, bending, and waviness. Their physical and chemical properties remain stable even in high-temperature environments, and they excel in thermal shock resistance. Additionally, they have a thermal expansion coefficient close to that of silicon and possess high thermal conductivity. 【Features】 ■ Excellent mechanical strength, with high-strength substrates available for increased durability ■ Outstanding oil and chemical resistance ■ High dielectric breakdown voltage, surface resistance, and volume resistance, with a low dielectric constant ■ High reflectivity substrates suitable for LED applications are also available.

• Printed Circuit Board

A rich product lineup of small, high-performance, multi-band, ACTIVE, and PASSIVE types. Is there such a GNSS antenna...? MARUWA offers a wide range of GNSS antenna products utilizing ceramic technology developed over many years. We can cater to our customers' diverse needs by allowing for differentiation based on usage and design concepts. By adopting a helical structure with our proprietary dielectric ceramic, we have four key features: 1. Wide directivity 2. Strong resistance to interference signals 3. Less affected by human bodies 4. Compact

• antenna

Our alumina substrates are produced using carefully selected high-purity alumina raw materials and under strict quality control, ensuring consistently stable quality and excellent properties.

• Printed Circuit Board

Thin film circuit substrates are materials created from the fusion of various proven ceramic materials and the thin film metallization technology developed over many years. Customization is possible through diverse pattern formation techniques, such as side metallization. They are used in circuit substrates for optical storage, optical communication, and RF applications. Through the integration of the thin film metallization technology that MARUWA has cultivated over many years and the underlying ceramic material technology, a consistent production process from material to thin film formation has been achieved. By using substrates with excellent heat dissipation properties, such as alumina substrates, aluminum nitride substrates, multilayer substrates, and dielectric ceramics, it is possible to form advanced circuit patterns that meet high integration and electrical characteristics.

• Printed Circuit Board

It is widely used for speakers, communication devices, motors, suction applications, relays, medical use, various sensors, and more.

• magnet

Aluminum nitride is used in heaters, electrostatic chucks, susceptors, clamp rings, cover plates, and other components for semiconductor manufacturing equipment, taking advantage of its high thermal conductivity and high corrosion resistance. It is also used in parts for medical devices such as MRI machines. MARUWA has established a consistent system from research and development to material production and machining, based on the material technology cultivated over many years. Through unique hot pressing methods and various machining processes, it is possible to meet the cutting-edge technical demands in semiconductor manufacturing equipment and medical applications.

• aluminum

We realize the commercialization of various high-density and multifunctional products for applications such as ceramic heaters, optical communication packages, LED packages, sensor packages, and SMD packages.

• High frequency/microwave parts

Dielectric ceramics can enable miniaturization of devices and improve the implementation density of microwave integrated circuits, and they are widely used in base stations for mobile communications such as mobile phones, as well as in microwave filters and circuit boards. Customization is possible according to size, shape, and other requirements.

• High frequency/microwave parts

We can customize products that meet customer needs, such as ultra-compact VCOs and small high-performance models using LTCC substrates, as well as high-performance models using our own coaxial resonators.

• High frequency/microwave parts

We can customize products using our own dielectric coaxial resonators to meet the diverse needs of our customers.

• High frequency/microwave parts

Thanks to our excellent surface polishing technology for sliding properties, we can accommodate sliding components other than valves. By applying our in-house developed carbon coating, it is possible to further enhance the sliding properties.

• Drive system parts

The MIB series is a power inductor that employs a closed magnetic circuit. It uses ferrite for the shielded core material, achieving low radiation noise.

• Inductor Coil

Due to the structurally low residual inductance, it has a better noise reduction effect at higher frequencies compared to conventional capacitors. It is non-directional and easy to handle. It is compliant with the RoHS directive.

• Capacitor

This product reduces residual inductance (ESL) by increasing the size of the ground electrode compared to usual, significantly improving noise removal effects in the high-frequency range. It is effective for EMI countermeasures in DC power lines, supporting large currents (~2A).

• Capacitor

Due to its structurally low residual inductance, it has a better noise reduction effect at higher frequencies compared to conventional capacitors. It is non-directional and easy to handle. It is a RoHS compliant product.

• Capacitor

A super small (2.0×1.25) chip-type three-terminal capacitor with structurally low residual inductance.

• Capacitor

Due to the structurally low residual inductance, it has a better noise reduction effect at higher frequencies compared to conventional capacitors. By offering high-capacity products, it enables noise countermeasures across a wider frequency range.

• Capacitor