東海神栄電子工業 Product Lineup

Introducing "Electropolishing Process for Metal Masks." By applying an electropolishing treatment to SUS plates after opening processing, it is possible to smooth out the unevenness of the inner walls of the openings. This treatment ensures stable and good solder printability for the mounting of components such as QFPs and BGAs with a 0.4mm pitch, as well as 0603 chip components. Our technology supports the resolution of quality issues and enhances quality. 【Features】 ■ Improved release of cream solder ■ Ability to smooth out the unevenness of the inner walls of the openings ■ Stable and good solder printability can be ensured *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

FPV substrate refers to Flat Pad on Via. With FPV substrates, it becomes possible to design 0.65 pitch BGA mounted substrates even without build-up substrates.

• Other services

It is a substrate with copper foil on both sides and inside of a glass epoxy insulating board.

• Other services

It is a substrate with copper foil on both sides of a glass epoxy insulating board.

• Other services

This is a substrate with copper foil on only one side of the paper phenol or glass epoxy insulating board. There is no copper foil on the walls of the holes. (It is produced using the line from the first factory.)

• Other services