It will be possible to design a board equipped with a BGA with a 0.65 pitch.
FPV substrate refers to Flat Pad on Via. With FPV substrates, it becomes possible to design 0.65 pitch BGA mounted substrates even without build-up substrates.
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basic information
【Features】 ○ BGA and CSP boards can be produced without increasing the difficulty of the substrate. ○ Initial costs can be kept low. ○ With more space available for via holes, routing patterns becomes smoother. ● For other functions and details, please contact us.
Price information
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Delivery Time
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Applications/Examples of results
【Usage】 ○ Various wiring boards ● For other functions and details, please contact us.
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Company information
At Tokai Shin-ei Electronic Industry Co., Ltd., we carry out all processes in-house to provide high-tech products and quick responses, delivering the highest level of satisfaction to our customers.
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