ミカドテクノス List of Products and Services

The "Mikado Vacuum Pressure Device Series" that we handle has achieved high-precision 2D pressurization (flat plate pressurization) by using a unique equal pressure system. By reducing the volume, rapid vacuuming is possible. Additionally, by adopting a heat dissipation post structure (international patent) and limiting the range of thermal influence, we have enabled uniform temperature, reduced heating and cooling times, and energy savings. It can be used for various applications including lamination, adhesion, bonding, transfer, sealing, laminating, molding, and impregnation. 【Features】 ■ Current value display and pumping pressurization are possible with a stroke sensor ■ Ensures rigidity during pressurization with a special die set structure, securely holding the load ■ By using transparent materials in part of the chamber, light energy can be irradiated during 2D or 3D pressurization ■ Chambers tailored to your requirements are available ■ The pressurization plate is detachable, improving maintainability *For more details, please refer to the PDF materials or feel free to contact us.

• Other semiconductor manufacturing equipment
• Vacuum Equipment
• Other mounting machines

The currently mainstream method of electroplating involves placing electrodes and products into a plating bath and passing an electric current, which causes metal ions in the plating solution to move towards the cathode and deposit metal. Since both the products and electrodes are immersed in the plating bath, the tank becomes larger, and the amount of plating solution used also increases. In the stamp-type plating method (SED method), it is possible to stamp (press) a solid electrolyte film onto the necessary parts at high speed, which reduces the amount of chemical solution used. This leads to a reduction in the time required for plating treatment and a compacting of the process, significantly reducing the environmental burden.

• Printed Circuit Board
• Wafer
• Plating Equipment

Using a pressure membrane, we have enabled isotropic pressure application to irregular shapes. We perform bonding and other processes using vacuum pressure on curved surfaces and irregular shapes. 《Features》 〇 This is a Mikado patented technology that allows isotropic pressure application on curved surfaces and steps. 〇 It is possible to apply pressure to any surface of irregularly shaped workpieces without the need for molds. 〇 Thanks to Mikado's unique chamber structure, atmosphere switching can be done in a short time. 〇 By using light energy, non-contact processing is also possible.

• Other semiconductor manufacturing equipment
• Printed Circuit Board
• Wafer

Mikado-style vacuum press machine, custom-made and tailor-made, with a cumulative sales record of over 300 units. Mikado Technos, with over 65 years of history, offers reliability and safety. The machine specifications are backed by meticulous service and extensive experience. The high repeat order rate is a testament to the quality of their technology.

• Other semiconductor manufacturing equipment
• Other mounting machines
• Forging Machine

In press processing, it is said that the fracture surface can be eliminated.

• Other machine elements
• Press Dies

The balancer-type vacuum heat press device features a vacuum isolation chamber inside the press, allowing for quick vacuum reduction to remove air bubbles (microvoids) and achieve uniform vacuum bonding. Mikado's quick vacuum heat press series offers extensive customization options. For more details, please download the catalog.

• Vacuum forming machine
• Vacuum Equipment

The 200℃ vacuum heat press device is equipped with a vacuum chamber inside the press mold, allowing for quick vacuum reduction to remove air bubbles (microvoids) and achieve uniform vacuum bonding. Mikado's quick vacuum heat press series offers extensive customization options. We manufacture devices tailored to your needs, from experimental machines to production machines. For more details, please download the catalog.

• Vacuum forming machine
• Vacuum Equipment

The UV curing vacuum heat press device can perform thermal imprinting, optical imprinting, and optical-thermal hybrid imprinting all in one machine. It allows for UV irradiation while applying pressure in a vacuum, enabling high-precision bonding and molding of products. Vacuum, pressure, and UV irradiation can be easily achieved. For more details, please download the catalog.

• Vacuum forming machine
• Vacuum Equipment

The vacuum high-pressure impregnation device reduces the pressure inside the chamber, allowing for the rapid development of functional new materials, forced impregnation of nanoparticles, functional processing of food, and chemical synthesis through gas replacement. It is ideal for the impregnation of nanoparticles, functional processing of food, and the development of new materials and composite materials. We also accept test experiments. For more details, please download the catalog.

• Vacuum forming machine
• Vacuum Equipment

The rental lab can be freely used as needed for the development of new products, test processing, product evaluation, and comparisons with conventional methods. Experiments can be conducted on heat curing and UV curing bonding in a vacuum, curved surface bonding, film molding, powder molding, imprinting, heat transfer, diffusion bonding, resin sealing, and more. Please make use of our laboratory equipped with the latest models from Mikado. For more details, please download the catalog.

• Vacuum forming machine
• Rental/lease

A vacuum chamber is attached inside the press mold, allowing for quick vacuum reduction to remove air bubbles (microvoids) and achieve uniform vacuum bonding. **Features** - Utilizing Mikado's unique pressurization method and thrust control, uniform pressure can be applied to large areas using a heating plate. - It has a wide thrust range from low to high thrust, accommodating various workpieces. - The instant vacuum chamber enables a reduction in decompression time. - As it supports semi-customization, devices reflecting customer requests can be proposed.

• Other processing machines
• Other semiconductor manufacturing equipment
• Circuit board processing machine