This is a device that can contribute to reducing environmental impact.
The currently mainstream method of electroplating involves placing electrodes and products into a plating bath and passing an electric current, which causes metal ions in the plating solution to move towards the cathode and deposit metal. Since both the products and electrodes are immersed in the plating bath, the tank becomes larger, and the amount of plating solution used also increases. In the stamp-type plating method (SED method), it is possible to stamp (press) a solid electrolyte film onto the necessary parts at high speed, which reduces the amount of chemical solution used. This leads to a reduction in the time required for plating treatment and a compacting of the process, significantly reducing the environmental burden.
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basic information
**Merits and Effects** - **Environmental (Ecology)** Since it is not necessary to immerse the workpiece in liquid chemicals, it is possible to reduce the amount of plating solution and cleaning water used. - **Excellent Film Formation Speed** High-speed transport of cations is possible. This structure makes it difficult to form a cation-depleted layer on the workpiece surface, allowing for a reduction in the distance between electrodes, which is expected to lead to smaller equipment. - **Low Cost** The significant reduction in the amount of plating solution and cleaning water greatly lowers running costs. Film formation is also fast, and while partial film formation previously required masking, only the areas in contact with the electrolyte film will have metal deposition, thus reducing the masking process. Since the main components passing through the solid electrolyte film are cations and a small amount of moisture, it can suppress the contact of foreign substances in the plating solution with the workpiece, making plating solution management easier. - **Stamping Method** By applying physical pressure to the film formation surface, denser film formation is possible compared to non-pressurized methods.
Price range
P7
Delivery Time
Applications/Examples of results
Subject: Copper plating (Nickel and gold plating methods under development)
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Company information
Our company was founded in September 1953 in the Ina region as an early precision deep drawing press processing company, and we have already surpassed half a century. During this time, we have received the support of many customers, continuously challenging ourselves to create unique and innovative products, and have obtained numerous intellectual property rights. We have also been honored with awards such as the Good Company Award Special Prize and recognition as one of the 300 Energetic Small and Medium Enterprises. Moving forward, regardless of the field, we aim to be a valued partner by leveraging our accumulated precision press processing technology and the MIKADO brand, established through air press, vacuum press, and automation technologies, to create products that bring joy to everyone.
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