List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

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It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...

  • Sensors

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High viscosity and slurry transfer is possible with no worries about liquid leakage! It is a self-priming pump that won't break even if run dry! Safe design for use in explosion-proof facilities.

  • Positive Displacement Pump

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From margin design that protects by looking at temperature to confident design that attacks by looking at heat flow.

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  • Dedicated IC

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We conducted a cleaning evaluation using samples created under conditions that are likely to leave residues intentionally!

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  • Other semiconductors

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A page on "Cleaning evaluation of organic residue remaining after sintering" has been added.

In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean solder bonding technology, sintering bonding is fundamentally designed to be "no-clean." However, the currently mainstream sintering bonding methods are conducted under high temperature and high pressure conditions, which can lead to the generation and adhesion of residues during the bonding process, potentially affecting subsequent processes and long-term reliability. Cleaning is one proposed solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. Detailed content of the technical column can be viewed through the related link.

Chemical calculation software / Finite element method simulator for predicting the performance of spin qubits before manufacturing.

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  • Other semiconductors

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Ideal for high-aspect ratio filling, from research and development to mass production.

  • Printing Machinery
  • Other semiconductors
  • Printed Circuit Board

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Designed for a wavelength range of 760 to 2900 nm with an accuracy of ±10 nm.

  • Other semiconductors

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QCL optimal for high-precision gas detection using TDLAS.

  • Other semiconductors

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FP laser with a wavelength of 760 to 6500 nm

  • Other semiconductors

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High-output DFB laser with a maximum of 40mW

  • Other semiconductors

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