The NHK program "The Wall of Truth" will feature a video of semiconductor wafer cleaning provided by our company.

Leave the latest ultrasonic cleaning to Sonosys.

Ultrasonic Cleaning Spray Nozzle For non-contact single substrate cleaning, we offer a megasonic nozzle with either a single nozzle, dual nozzle, or triple channel, and any combination of frequencies ranging from 600kHz to a maximum of 9MHz. The transducer of this megasonic nozzle generates megasonics and sends them through a fluid (such as pure water) to clean the surface of the substrate. Megasonic Immersion Transducer This is a megasonic immersion transducer with frequencies of 400kHz, 600kHz, 1MHz, and 2MHz. A sealed transducer made of stainless steel or plastic (e.g., PP, PVDF, or PFA) is installed at the bottom or side of an existing tank. In addition to standard systems for substrate sizes of 4", 6", and 8", custom immersion transducers are also available. The highly adaptable configuration allows the megasonic system to be used in bath-tank cleaning processes, improving cost-effectiveness. Frequencies available are 400kHz, 600kHz, 1MHz, and 2MHz.

• CVD Equipment
• CMP Equipment
• Photomask

The Digital Generator is a digital control generator compatible with megasonic cleaning systems for semiconductors, electronic components, and precision instruments.

The Sonosys Digital Generator is a next-generation digital generator developed for megasonic cleaning. It supports a wide frequency range from 400 kHz to 9 MHz, achieving high-precision output control with a maximum of 35W and a minimum of 0.35W. It is equipped with remote monitoring and control functions via Modbus communication, allowing real-time visualization of output, temperature, and operating status. Additionally, it is compatible with existing Sonosys nozzles, promoting smart factory initiatives while keeping equipment upgrade costs down. This innovative solution contributes to quality improvement and digital transformation in semiconductor cleaning, electronic component cleaning, and precision parts cleaning.

• Wafer
• Photomask
• Other semiconductor manufacturing equipment

Next-generation megasonic technology can instantly clear wafers up to 300mm.

The SONOSYS 1MHz megasonic system (FTF transducer & MGH generator) is a high-performance system designed to optimize the cleaning process of single substrates. The main features are as follows: - High-precision cleaning: The PFA-sealed transducer is installed approximately 1.5mm from the substrate, delivering megasonic energy uniformly. - Patent technology: Utilizing "butterfly piezoelectric ceramic" technology, it achieves up to 40% higher sound pressure and up to 30% higher efficiency compared to conventional systems. - Single process compatibility: Suitable for cleaning substrates or wafers up to 300mm. - High output specifications: Features an output adjustment range of 150W (approximately 20% to 100%) and utilizes 1MHz ultrasound. - Stable operating environment: The enclosure is a compact 19-inch design. - Operating temperature range is +10°C to +40°C. - Durability and adaptability: Capable of handling liquid temperatures up to +80°C (when using nitrogen cooling). - PTFE-coated coaxial HF cable (3m) included. - Precision design: Installation distance is approximately 1.5mm (at 1MHz), with a minimum liquid layer thickness of approximately 4mm on the substrate.

• Photomask
• Other semiconductor manufacturing equipment
• Ultrasonic Cleaner

A collaborative product of Rehila's nozzle technology and Sonosys's ultrasonic technology.

Particles (droplets) formed by the ultrasonic spray nozzle are broken up by the vibrations of the piezo element. In other words, unlike pressurized systems, the particles do not have speed. As a result, they either fall naturally or float due to the influence of the wind. Therefore, carrier air is used to transport the formed particles for application.

• Ultrasonic Oscillator
• nozzle
• Coating Machine

Surface cleaning for MEMS device manufacturing with Sonosys ultrasonic cleaning.

In MEMS device manufacturing, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to decreased device performance and lower yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in MEMS device manufacturing. 【Application Scenarios】 - Removal of foreign substances in the MEMS device manufacturing process - Cleaning of precision parts - Rinse process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Sonosys's ultrasonic cleaning solves the challenges of wafer cleaning.

In the semiconductor manufacturing industry, particularly in wafer production, the removal of fine foreign substances and residues is a critical issue that affects product quality. Even slight contamination on the wafer surface can lead to a decline in device performance and a decrease in yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, thereby contributing to quality improvement in wafer manufacturing. 【Usage Scenarios】 - Removal of foreign substances in the wafer manufacturing process - Cleaning of precision parts - Rinse process after chemical cleaning 【Benefits of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Precision cleaning of optical lenses with Sonosys ultrasonic cleaning.

In optical lens manufacturing, the removal of fine foreign substances and residues is a crucial issue that affects product quality. Even slight dirt on the lens surface can lead to a decline in device performance and a deterioration in yield. Sonosys's ultrasonic megasonic cleaning equipment addresses these challenges by achieving high cleaning power and uniform cleaning, contributing to quality improvement in optical lens manufacturing. 【Application Scenarios】 - Removal of foreign substances in the optical lens manufacturing process - Cleaning of precision parts - Rinsing process after chemical cleaning 【Effects of Implementation】 - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Ultrasonic cleaning by Sonosys for slurry removal in CMP engineering.

In the CMP process, the removal of slurry from the wafer surface is a critical process that affects product quality. Residual slurry on the wafer surface can lead to defects and reduced yield in subsequent processes. Sonosys' ultrasonic megasonic cleaning equipment achieves high cleaning power and uniform cleaning, contributing to quality improvement in the CMP process. [Usage Scenarios] - Slurry removal in the CMP process - Foreign matter removal in the wafer manufacturing process - Rinse process after chemical cleaning [Effects of Implementation] - Reduction in cleaning time - Improvement in cleaning quality - Enhancement of yield

• Ultrasonic Oscillator
• Ultrasonic Cleaner
• Ultrasonic cleaner

Fukuda Corporation has been pursuing leak detection for 60 years and is dedicated to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing performance. We will propose suitable testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

This is a collection of links to Fukuda's technical columns. It covers various topics related to leak tests and more... Please check the related links for more information.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for metal crack repair without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material with heat. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or variations in dimensions, can be molded at the same time in one molding process. This allows for the verification of multiple types in a short period.

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding methods for repairs can change the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Waterworks Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for metal crack repairs without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.