メムス・コア List of Products and Services

In stealth dicing processing technology, MEMS wafers and LSI wafers can be divided into chips without "cutting lines" and through a "dry process," which is expected to yield significant benefits not found in conventional dicing methods. Especially in the development of MEMS devices with fragile structures, we recommend utilizing this technology from the design, prototyping, and development stages.

• Contract manufacturing

We provide comprehensive support not only for individual processes but also for device design, simulation, principle prototyping, prototype device fabrication, and mass production. Additionally, through collaboration with external fabs and academic institutions, we offer valuable services that are highly competitive. We also possess unique processes specific to MEMS manufacturing (micromachining) that cannot be achieved with semiconductor process technology.

• Contract manufacturing