We are advancing the development and commercialization of new generation MEMS products.
In stealth dicing processing technology, MEMS wafers and LSI wafers can be divided into chips without "cutting lines" and through a "dry process," which is expected to yield significant benefits not found in conventional dicing methods. Especially in the development of MEMS devices with fragile structures, we recommend utilizing this technology from the design, prototyping, and development stages.
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basic information
【Features】 ○ Completely dry process ○ Zero dust generation ○ No chipping, strong against bending strength ○ Zero cutting margin ● For other functions and details, please contact us.
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Applications/Examples of results
【Purpose】 ○Division of MEMS wafers ○Division of LSI wafers ●For other functions and details, please contact us.
Company information
"MEMS" is derived from the initials of "Micro Electro Mechanical System." It is difficult to define MEMS if it is too biased towards electronics like LSI, or if it only involves mechanical movements like micro-machines, and even micro-sensors alone provide little added value. It is only when these elements are systematized that the true potential of MEMS can be realized. After all, movements occur in areas that can only be seen under a microscope, and these movements create images, serve as the tactile sense for robots, and control the movements of automobiles. I remember being excited watching the sci-fi movie "Fantastic Voyage" over 30 years ago, where a miniature submarine navigates inside the human body, but now sensors can travel through blood vessels and even reach the fine capillaries in the brainstem. The technology to miniaturize mechanisms to the extreme is only possible with MEMS and is gaining attention as a crucial foundational technology that adds value to systems across various industries. We own numerous MEMS manufacturing devices and are functionally utilizing the technology accumulated by Tohoku University and various companies in the Chemtronics Group for manufacturing, advancing the development and commercialization of next-generation MEMS products.
![[Introduction to Processing Technology] Dicing Process](https://image.mono.ipros.com/public/product/image/8e5/2000717360/IPROS62688781017819538931.png?w=280&h=280)
