[Introduction to Processing Technology] Dicing Process

Glass, ceramics, crystalline materials, various substrates, etc.! Leave contract processing and difficult machining to us!

We would like to introduce the dicing technology 'Dicing Processing' held by Shinko. Tape dicing achieves a reduction in scratches, dirt, and foreign material attachment, as well as cost reduction. Additionally, we can perform alignment cutting using various software, suppress and remove burrs (plating and metallization), and support high-pressure nozzles and two-fluid spin cleaning machines. We respond to customer needs with reliable quality from small-scale prototypes to mass production. 【Features】 ■ Tape Dicing: Reduction of scratches, dirt, and foreign material attachment, cost reduction ■ Square Chuck Table: Supports large substrates and reduces costs through multi-layer processing ■ Alignment cutting using various software ■ Suppression and removal of burrs (plating and metallization) ■ Capable of cutting and grooving thick materials (up to t10mm) ■ Compatible with high-pressure nozzles and two-fluid spin cleaning machines *For more details, please refer to the PDF document or feel free to contact us.

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