We will cut the IC chips smaller, thinner, and process them with greater precision.
Suntech Co., Ltd. provides cutting (dicing) and grinding (thinning) processing technologies primarily for semiconductor silicon wafers. Additionally, these processing technologies are applied to various materials that are considered difficult to process, such as blue glass, ceramics, and solder sheets. We utilize technologies such as back grinding (grinding and polishing), dicing, chip tray technology, and visual inspection technology. Furthermore, Suntech's prototype technology support division offers clean rooms and processing equipment. For more details, please contact us or refer to our catalog.
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basic information
**Features** [Dicing Processing Technology] - Not only does it have a track record of mass processing for semiconductor silicon wafers, but it also handles difficult-to-process materials such as optical glass, ceramics, and solder sheets. - A patent application is currently pending for the chip processing of solder sheets. - For blue plate glass, we deliver high-quality products with minimal cracking through our unique dicing method and a patented inspection method currently under application. - For products where damage to the substrate surface is not desired, dicing is performed using surface protection tape. [Back Grinding (Grinding and Polishing) Processing Technology] - The workpiece is fixed using Santec's unique ring method, allowing us to meet various customer needs. - Back grinding processing is possible for chip products (even a single chip) and individual wafers. [Chip Tray Technology] - Supports classification by map method (up to 24 classifications possible). - Tray packing is possible for chip sizes down to 0.3mm square. [Visual Inspection Technology] - Inspection magnification can be supported from 25x to 500x. - Dimensional measurement is possible up to 1/1000. ● For more details, please contact us or refer to our catalog.
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Company information
Suntech Co., Ltd. has been advancing step by step as a technical group in semiconductor processing since its establishment, receiving strong support from our customers and serving as a member of the semiconductor industry. Since the birth of the processing technology known as "dicing," we have collaborated with equipment manufacturers to refine our microfabrication techniques. We not only provide technology for dicing processing but also pursue Q (Quality), D (Delivery), and S (Service) to deliver satisfaction to our customers. We assist a wide range of clients, including major semiconductor glass manufacturers and venture companies. We aim to foster the individuality of each employee, providing an environment where their strengths can be fully realized, and we are united in our efforts to achieve the highest quality in dicing processing and engage in environmentally conscious corporate activities.
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