Dicing process
Our company handles processing not only of Si wafers but also of glass, ceramics, single crystal materials, and resins. Cutting water can be compatible with pure water. We can accommodate everything from prototype processing to mass production. Additionally, we can support cutting methods tailored to your applications (such as scribing), so please feel free to consult with us.
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basic information
To accurately cut out and chip the circuits formed on Si wafers, a method called dicing is used. The mainstream approach is to use a dicing machine equipped with a rotating blade. Processing techniques: full cut, half cut, U-groove and V-groove processing Materials: various types of glass, ceramics, single crystal materials, resins, etc. Shapes: round flat plates, square flat plates Outer dimensions: max φ12 inches (for Si wafers) Substrate thickness: max 3mm (for glass) We also handle polishing of glass and back grinding of Si wafers. Automatic chip tray packing is also possible.
Price information
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Applications/Examples of results
IC chips, various ceramic components, optical pickup components, various electronic components, cover glass, etc.
Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.
![Explanation of the differences between simultaneous 5-axis machining machines and machining centers [Presentation of explanatory materials!]](https://image.mono.ipros.com/public/product/image/108/2000578985/IPROS88373438746681799159.png?w=280&h=280)
