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Although it was introduced a year ago, I will explain the vacuum reflow (formic acid reduction type), which has been increasingly requested lately. This is a soldering device using a vacuum reflow method suitable for applications that require clean joints where flux residues and solder splatter are not allowed. By removing the metal oxide film from the solder and substrate through formic acid treatment and controlling the temperature through a combination of direct heating with IR heaters and forced cooling with water-cooled blocks, high-speed soldering is achieved. It is equipped with a bottle-in supply that eliminates the need for transferring formic acid, a vaporizer that instantly gasifies formic acid, and a formic acid decomposition treatment unit that neutralizes exhaust, allowing for the safe operation and management of highly corrosive formic acid from supply to exhaust. The demand has been increasing recently.

We have introduced the Hitachi ES-76LM thermal shock testing machine (heat cycle testing machine). It can conduct heat cycle tests from a low temperature of -70 degrees to a high temperature of 200 degrees. Compliant with MIL standards: it comes with compatible programs. We will perform heat cycle tests at your desired temperature.