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  1. Home
  2. Electronic Components and Semiconductors
  3. ハヤシレピック 第3事業部
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Electronic Components and Semiconductors
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ハヤシレピック 第3事業部

EstablishmentApril 1968
capital5000Ten thousand
number of employees70
addressChiba/Tateyama-shi/Hojo 1292
phone0470-22-8021
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last updated:Feb 09, 2023
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Micro assembly and inspection

Microscale assembly that must be performed under a microscope. We undertake visual inspections at high magnification under a microscope.

Our company utilizes semiconductor assembly and inspection technology to perform fine assembly and inspection. Of course, this work is done in a clean room. To date, we have a track record of micron-order component joining, adhesive assembly, fine soldering, and visual inspection of subcomponents and IC chips.

  • EMS
  • Other semiconductors

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Heating head

The heating head HDR-0670 is a heating head compatible with plastic cards that are 54mm wide.

The heating head HDR-0670 is a heating head with a thick film heater that accommodates plastic cards with a width of 54mm. It can be driven by DC24V, making it easier and safer to integrate into setups compared to heating rollers that operate on AC100V to 240V. Unlike heating rollers that maintain high temperatures constantly, the heating head uses on-demand heating, raising the temperature only when necessary, which saves energy. Additionally, it enables real-time control that increases energy only when cards pass through, even when cards are continuously passing at regular intervals. The surface of the heater is made of durable ceramic, and you can choose a surface coating material according to your needs.

  • Sealing machine
  • Ceramic Heater
  • Other surface treatment equipment

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Clean washing and packaging service

We will perform cleaning of parts for semiconductor manufacturing equipment that require a high level of cleanliness.

At Hayashi Repic Co., Ltd., we perform cleaning of parts that require a high level of cleanliness in a clean environment, such as semiconductor manufacturing equipment. We provide clean washing and clean packaging for products (mainly parts used in semiconductor equipment, connector wire harnesses, etc.). All processes are carried out in a clean room (Class 1000). We can accommodate cleaning items up to the size of 300mm × 250mm × 150mm. We also accept assembly of cleaned items. 【Features】 - Double packaging from clean room to clean room maintains cleanliness. - Gas chromatography testing (GC/MS) is also available upon request. For more details, please contact us or download the catalog.

  • Other services

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HDD/SSD Evaluation Technology Services

We are conducting evaluations of HDD/SSD (temperature/humidity/cycles/failure analysis).

We conduct reliability evaluations of HDDs (Hard Disk Drives) and SSDs (Solid State Drives), durability tests in high-temperature and high-humidity environments, cycle tests, and failure analysis. By screening HDDs and aging SSDs, we can reduce the initial failure rate and field incidental failure rate. This is also ideal for performance verification of used HDDs, inventory items, and operational products. 【Features】 ○ Support for small quantities and single items ○ Collaborative service with San-ei Electronic Industries For more details, please contact us or download the catalog.

  • Public Testing/Laboratory
  • Contract Analysis

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Semiconductor assembly and packaging implementation

We perform assembly and packaging of semiconductors (communication systems/MEMS, etc.). We also offer rework services. There is a vacuum reflow available.

In the 3rd Business Division (formerly the Electronic Device Division), we receive semiconductor chips (silicon-based, compound semiconductors, MEMS, etc.) from our customers and carry out assembly and inspection for ceramic packages and other applications. We also have experience in COB (Chip on Board) assembly, where chips are directly mounted onto substrates. 【Features】 - Prototyping is possible, as well as mass production with single processes. - We can handle chips that are difficult to manage and prone to cracking or chipping with care. For more details, please contact us or download the catalog.

  • Other semiconductors

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Thick film technology, research, cooperation

We will perform pattern printing on ceramic substrates using thick film printing.

Hayashi Repic Co., Ltd. manufactures substrates using thick film technology. We cater to high heat-resistant and high heat-dissipating electronic circuit substrates such as ceramic substrates. Thick film printing technology has no limitations on the printed materials and challenges various materials and applications. We accept small-scale prototypes and custom items. 【Related Products】 ○ Thick film circuits ○ Heaters ○ Radiation detectors ○ Sensors For more details, please contact us or download the catalog.

  • Other electronic parts

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  • 令和8年度 ゼロエミ製品 開発助成金 電子申請 受付中 ゼロエミッションを推進する製品開発、改良、 規格等適合化に要する経費の一部を助成します。 助成金額 単独 1,500万円 共同 3,000万円
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