We will perform cleaning of parts for semiconductor manufacturing equipment that require a high level of cleanliness.
At Hayashi Repic Co., Ltd., we perform cleaning of parts that require a high level of cleanliness in a clean environment, such as semiconductor manufacturing equipment. We provide clean washing and clean packaging for products (mainly parts used in semiconductor equipment, connector wire harnesses, etc.). All processes are carried out in a clean room (Class 1000). We can accommodate cleaning items up to the size of 300mm × 250mm × 150mm. We also accept assembly of cleaned items. 【Features】 - Double packaging from clean room to clean room maintains cleanliness. - Gas chromatography testing (GC/MS) is also available upon request. For more details, please contact us or download the catalog.
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basic information
【Example of Engineering】 ○ Solvent cleaning with an abzorber cleaning machine ○ Ultrasonic cleaning with ultra-pure water ○ Vacuum baking ○ Double packaging ● For more details, please contact us or download the catalog.
Price information
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Delivery Time
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Applications/Examples of results
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Detailed information
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This is a cleaning machine for Abzole. It operates in a cycle of high-temperature and low-temperature cleaning, ultrasonic cleaning, and vacuum drying using bromine-based cleaning solution Abzole.
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Company information
At Hayashi Repic Co., Ltd., the 3rd Business Division focuses on the assembly of semiconductor components, particularly for optical microwave communication-related parts. We specialize in inspections and work using microscopes within clean rooms. Additionally, we conduct clean washing for semiconductor equipment, thick film printing on ceramic substrates, and durability testing and failure analysis for HDDs/SSDs. We have obtained ISO 9001, ISO 14001, and ISO 27001 certifications, and we are confident in our cost and delivery capabilities, so we hope you will consider utilizing our services.
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