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  3. Electronic Components and Modules
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  5. EMS
  6. Micro assembly and inspection

Micro assembly and inspection

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last updated:Jan 20, 2021

ハヤシレピック 第3事業部
ハヤシレピック 第3事業部
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Microscale assembly that must be performed under a microscope. We undertake visual inspections at high magnification under a microscope.

Our company utilizes semiconductor assembly and inspection technology to perform fine assembly and inspection. Of course, this work is done in a clean room. To date, we have a track record of micron-order component joining, adhesive assembly, fine soldering, and visual inspection of subcomponents and IC chips.

    Other semiconductorsEMS
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Micro assembly and inspection

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Inspection under a microscope. Assembly and inspection work in a clean room. Small parts assembly work, as well as prototyping and mass production, are also carried out.

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※The delivery time varies depending on the quantity, but it is approximately 2 weeks.

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Microscopic inspection. Assembly and inspection work in a clean room. Assembly of small parts. Prototype and mass production.

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    Microscopic examination in a clean room.

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Microscopic examination and fine assembly

Microscopic examination and fine assembly

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ハヤシレピック

ハヤシレピック 第3事業部

Electronic Components and Semiconductors

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At Hayashi Repic Co., Ltd., the 3rd Business Division focuses on the assembly of semiconductor components, particularly for optical microwave communication-related parts. We specialize in inspections and work using microscopes within clean rooms. Additionally, we conduct clean washing for semiconductor equipment, thick film printing on ceramic substrates, and durability testing and failure analysis for HDDs/SSDs. We have obtained ISO 9001, ISO 14001, and ISO 27001 certifications, and we are confident in our cost and delivery capabilities, so we hope you will consider utilizing our services.

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