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At Optotech, we are committed to designing and manufacturing custom-made semiconductors to meet the various needs that arise from the increasing functionality and complexity of sensors. Please feel free to consult us about semiconductor miniaturization, lightweighting, and high-density solutions. We handle everything from prototype specification discussions to mass production as a total system, which can lead to further cost reductions in manufacturing expenses, including labor and component purchasing and management costs.
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Free membership registrationAt OptoTechno, we are committed to designing and manufacturing custom-made semiconductors to meet the various needs that arise from the increasing functionality and complexity of sensors. Please feel free to consult us about miniaturization, lightweight design, and high-density integration of semiconductors. We handle everything from specifications for prototypes to mass production as a total system, which allows for further cost reductions in manufacturing expenses, including labor, component purchasing, and management costs.
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Free membership registrationAt Optotech, we are committed to designing and manufacturing custom-made semiconductors to meet the various needs that arise from the increasing functionality and complexity of sensors. Please feel free to consult us about semiconductor miniaturization, lightweighting, and high-density solutions. We handle everything from prototype specification discussions to mass production as a total system, allowing for further cost reductions in manufacturing expenses, including labor, component purchasing, and management costs.
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Free membership registrationAt Optotech, we are committed to designing and manufacturing custom-made semiconductors to meet the various needs that arise from the increasing functionality and complexity of sensors. Please feel free to consult us about miniaturization, lightweighting, and high-density integration of semiconductors. We handle everything from discussions on prototype specifications to mass production as a total system, which can lead to further cost reductions in manufacturing expenses, including labor costs and component purchasing and management fees.
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Free membership registrationAt Optotech, we are committed to designing and manufacturing custom-made semiconductors to meet the various needs that arise from the increasing functionality and complexity of sensors. Please feel free to consult us about semiconductor miniaturization, weight reduction, and high density. We handle everything from discussing the specifications of prototypes to mass production as a total system, which can lead to further cost reductions in manufacturing expenses, such as labor costs and component purchasing and management fees.
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Free membership registrationAt Optotech, we are committed to designing and manufacturing custom-made semiconductors to meet the various needs arising from the increasing functionality and complexity of sensors. Please feel free to consult us about semiconductor miniaturization, weight reduction, and high density. We handle everything from specifications for prototypes to mass production as a total system, allowing for further cost reductions in manufacturing expenses, including labor, component purchasing, and management costs.
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Free membership registrationAt Optotech, we are committed to designing and manufacturing custom-made semiconductors to meet the various needs arising from the increasing functionality and complexity of sensors. Please feel free to consult us about semiconductor miniaturization, weight reduction, and high density. We handle everything from prototype specification discussions to mass production as a total system, enabling further cost reductions in manufacturing expenses, such as labor and component purchasing and management costs.
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Free membership registrationThe wafer size is a maximum of 4 inches, with a thickness of 200 to 500 μm. The electrode materials include Al, Al-Si-Cu, and Al-Cu, among others. The formation of SiN and photolithography is possible, and the formation of Au bumps and dicing can be done for supplied wafers up to a maximum of 8 inches. Dicing and tray packing will also be performed.
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Free membership registrationPlease feel free to consult us about the miniaturization, lightweight design, and high density of semiconductors. We handle everything from discussions on prototype specifications to mass production as a total system, allowing for further cost reduction in manufacturing expenses such as production labor, component purchasing costs, and management fees.
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