We will manufacture according to the client's specifications.
The wafer size is a maximum of 4 inches, with a thickness of 200 to 500 μm. The electrode materials include Al, Al-Si-Cu, and Al-Cu, among others. The formation of SiN and photolithography is possible, and the formation of Au bumps and dicing can be done for supplied wafers up to a maximum of 8 inches. Dicing and tray packing will also be performed.
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basic information
【Features】 ○ Formation of SiN and photolithography is possible. ○ Formation of Au bumps and dicing can be done up to a maximum of 8 inches with supplied wafers. ○ Dicing and tray packing are also performed. ● For other functions and details, please download the catalog.
Price information
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Delivery Time
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Applications/Examples of results
【Usage】 ○ Dummy chip ● For other functions and details, please contact us.
catalog（1）
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Company information
At Optotech, we are committed to designing and manufacturing custom-made semiconductors to meet the various needs arising from the increasing functionality and complexity of sensors. Please feel free to consult us about semiconductor miniaturization, lightweighting, and high density. We handle everything from prototype specification discussions to mass production as a total system, enabling further cost reductions in manufacturing expenses such as labor, component purchasing costs, and management fees.