超音波材料診断研究所 Company Profile

A) "Computer-Aided Ultrasonic Material Diagnosis" combining ultrasonic propagation analysis and theoretical analysis B) The latest ultrasonic measurement and diagnostic technology through joint research with Nagoya Institute of Technology

A) A technology for imaging closed cracks and kissing bonds that cannot be detected by conventional ultrasound using scattered waves. B) A technology for evaluating the adhesion of coating layers and the integrity of the interface with the base material. C) A technology for detecting gaps on the order of nanometers using waves at integer multiples of the incident frequency (harmonics). D) A technology for detecting internal defects just below the surface of die-cast parts and similar components. E) Introduction of research content: - Non-destructive testing (Journal of the Japan Society for Non-Destructive Inspection) September 2005, p. 509 - Research on machines (Yokendo) serialized course from the November 2005 issue: "Non-destructive evaluation and inspection for manufacturing" - Kyoritsu Publishing "The Frontiers of Non-Destructive Testing Engineering" published in December 2005.