サンシン List of Products and Services

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and has provided them both domestically in Japan and globally. We are a manufacturer that designs and manufactures according to customer requests, based on our technology, experience, and many years of achievements. Our belt polishing machine was developed with the aim of reducing polishing time, which has been a challenge with conventional film-type flat polishing machines. 【Applications】 ◆ Flat polishing of various metal plates ◆ Flat polishing of various resin plates ◆ Flat polishing and trimming of substrates ◆ Flattening of epoxy laminated substrates, etc.

• Grinding Machine

The film polishing equipment we handle can achieve uniformity in roughness during ultra-finish processing, reduce processing time, and enable automation. This time, we are conducting demonstrations of polishing equipment tailored to the workpieces and consultations regarding polishing. The main exhibits include external diameter polishing machines, internal diameter polishing machines, end face polishing machines, robotic polishing machines, and belt polishing machines. We invite you to visit us. 【Main Exhibited Products】 ■ External Diameter Polishing Machine ■ Internal Diameter Polishing Machine ■ End Face Polishing Machine ■ Robotic Polishing Machine ■ Belt Polishing Machine *For more details, please download the catalog or feel free to contact us.

• Wafer processing/polishing equipment

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and has provided them both domestically in Japan and globally. We offer a variety of film polishing machines tailored to our customers' needs. Our end face polishing machines are primarily used in the final finishing processes of various automotive parts, contributing to improved roughness and stable process capability values. 【Applications】 ◆ Lifter end faces ◆ Gear end faces ◆ Groove polishing, etc. <Reasons to Choose Sanshin's Polishing Machines> ■ A manufacturer specializing in film polishing machines with high technology ■ Customization (special jigs) available to meet customer requirements ■ Sample testing before installation possible with various demo machines ■ Suggestions for suitable polishing conditions based on processing know-how

• Other machine tools

As products become more advanced, there is a growing demand for more precise polishing methods. The polishing equipment handled by Sanshin uses polishing films coated with abrasive particles on polyester film, making it easy to improve surface roughness and flattening in the final finishing process of various workpieces. While manual polishing requires skilled techniques, introducing polishing equipment can also address issues related to labor shortages and the transfer of skills. This document explains the purpose and features of Sanshin equipment. [Contents] 1. About film polishing methods 2. Outer diameter polishing equipment 3. Inner diameter polishing equipment 4. Flat polishing equipment 5. Automatic supply and discharge *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and we have provided them both domestically in Japan and globally. This time, we would like to introduce three of our proud polishing machines: 1. Flat Polishing Machine → For flat finishing, flattening, and removing protrusions on various flat surfaces. 2. Outer Diameter Film Polishing → For ultra-finishing the outer diameter of various shafts. 3. Flat Lapping Machine → For lapping the end faces of workpieces using film. *The above three models will be exhibited at JIMTOF in November. Please come and see our technology at the venue (exhibition information is in the basic information section). <Reasons why our polishing machines are chosen> ■ Manufacturer specialized in film polishing machines ■ Customization (special jigs) support and proposals available ■ Sample testing before installation possible with various demo machines ■ Proposals for optimal polishing conditions based on processing know-how

• Wafer processing/polishing equipment
• Flat/Shaped/Vertical Cutting Machine
• Processing Contract

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and has provided them both domestically in Japan and globally. We offer a variety of film polishing machines tailored to our customers' needs. Our flat lap machines are primarily introduced in the final finishing processes of automotive parts and electrical and electronic components, contributing to improved roughness and flatness. Polishing is performed by moving a flat plate covered with film in a circular or figure-eight motion (patented). Since it is a lap machine that does not use slurry, there is no need for slurry management. It is also possible to create a fully automated lap machine with a conveyor tailored to your specifications. 【Applications】 ◆ Flat polishing of oil pump inner and outer rotors ◆ Polishing of fiber optic ends ◆ Polishing of flat mating surfaces requiring airtightness ◆ End faces of hydraulic pump parts 　etc. <Reasons for choosing Sanshin's polishing machines> ■ Manufacturer specialized in film polishing equipment ■ Customization according to customer requests (special jigs) is possible ■ Sample testing before introduction is possible with various demo machines ■ Proposals for optimal polishing conditions based on processing know-how are also available.

• Engine parts
• Wafer
• lens

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and has provided them both domestically in Japan and globally. We offer a variety of film polishing machines tailored to our customers' needs. Our flat polishing equipment is primarily used in the final finishing processes of automotive parts and electrical and electronic components, contributing to improved roughness and flatness. It also has the capability for controlled depth polishing through numerical control. 【Applications】 ◆ Flattening of laminated substrates (such as 5G substrates) ◆ Cleaning of smartphone glass ◆ Flattening of mobile communication system substrates ◆ Flattening during power semiconductor manufacturing 　etc. <Reasons to Choose Sanshin's Polishing Machines> ■ Manufacturer specialized in film polishing equipment ■ Customization according to customer requests (special jigs) is possible ■ Sample testing before installation is possible with various demo machines ■ We can propose suitable polishing conditions based on processing know-how.

• Engine parts
• Wafer
• lens

The "SCL-8SS" is a device that cuts the outer diameter of a motor's commutator using a special shaving bit and performs deburring with a brush after cutting. The workpiece is set on a diamond V-block, and by pressing the start button, it executes the cutting cycle and deburring with a brush in a semi-automatic manner. It accommodates shaft diameters from φ6 to φ12. 【Features】 ■ Can accommodate slight differences in shaft length ■ Allows for changes in cutting speed through simple operation to achieve the desired surface roughness ■ The two-stage cutting mechanism enables rough and finishing processes within the same device, reducing downtime ■ Cutting feed settings can be adjusted using a servo * There is also a fully automatic cutting machine available for inline use. Please refer to the SCL-7WBA for more details. * For more information, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment

- Improvement of surface accuracy in multi-process machining for axis shapes made possible with a single HEAD. - Enhancement of final surface accuracy for end faces of glass, ceramics, resin substrates, etc. - Improvement of surface accuracy for the outer diameter circumference of power semiconductors, silicon wafers, etc.

• Other semiconductor manufacturing equipment
• Grinding Machine

"Film polishing" is a polishing method that uses a film-like sheet surface called wrapping film, to which fine abrasive particles are adhered. This document serves as an introductory guide to the basic knowledge of film polishing, covering topics such as "What is film polishing?", the "Differences between film polishing and buff polishing," and the "Differences between film polishing and lap grinding." Please take a moment to read through it. [Contents] ■ What is film polishing? ■ What is Sanshin's Super Finisher? ■ Differences between film polishing and buff polishing ■ Differences between film polishing and lap grinding ■ Next time (internal diameter polishing, ball screw polishing, spherical polishing) *For more details, please refer to the PDF document or feel free to contact us.

• Other machine tools
• Wafer processing/polishing equipment

The "SFM" is a unit for precision grinding of shafts and similar components. It can be attached to lathes and allows for precision machining. Additionally, depending on the workpiece, the film width can be selected, enabling high-efficiency and low-cost processing. It is primarily introduced in the final finishing process of various automotive parts shafts and is suitable for improving the roughness of sliding and sealing areas. The outer diameter grinding unit can also be applied to grinding end faces and inclined surfaces. We offer a lineup of grinding units that can be attached to customer lathes and table-top grinding machines equipped with work rotation mechanisms. Furthermore, it can be used for both dry and wet processing, and the processing environment is clean and compact. 【Features】 - Achieves approximately 30% space-saving compared to conventional machines - Can obtain surface roughness according to purpose - Allows for precision finishing regardless of experience level - Capable of uniform finishing with a constantly new abrasive surface - Processing environment is clean and compact *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Engine parts
• lathe

Super Finisher flat surface grinding allows even beginners to subtly differentiate the use of laps on the back side of the stamper original plate, and the environment is clean. The stamper back surface grinding device polishes the back side of the stamper using a lapping film. The clamping and unclamping of the workpiece is done by the operator, while roll grinding, pad grinding, brush cleaning, and air blowing are performed automatically. The various surface roughness requirements from different companies can be processed under optimal conditions by selecting the appropriate lapping tape and changing the parameters of the device. *Features* 【Stamper Back Surface Grinding Device】 - Various surface roughness requirements from different companies can be processed under optimal conditions by selecting the appropriate lapping tape and changing the parameters of the device. - The circumference of the roll grinding can be randomized with pad grinding. - Once the conditions are set, even beginners can operate it easily. 【Thin Plate Flat Surface Grinding Device】 - The film width can be selected according to the workpiece (supports two types), achieving high efficiency and low-cost processing. - Effective for polishing various substrates and removing fine burrs from punched parts. - If a sub-table is provided, external setup can be done during processing time. *For more details, please download the materials or contact us.*

• Other machine tools
• Wafer processing/polishing equipment
• Special Processing Machinery

We would like to introduce a case study proposed by Sanshin Co., Ltd. that addresses on-site issues. A certain electronic device manufacturer was troubled by the burrs that appeared when small holes were drilled into flat plates and wanted to eliminate them. In response, we proposed our "Flat Grinding Machine," which is capable of removing fine burrs that form on flat surfaces. As a result, the removal of burrs led to an improvement in quality. 【Case Study】 ■ Issue - Wanted to eliminate burrs that appeared when small holes were drilled into flat plates. ■ Proposal - Proposed the "Flat Grinding Machine." *For more details, please refer to the PDF document or feel free to contact us.

• Other surface treatment equipment
• Wafer processing/polishing equipment
• Other abrasives

This document features the characteristics of "Sanshin Film Polishing" by Sanshin Co., Ltd., which handles precision surface processing machines. It provides an easy-to-understand explanation using diagrams on how the polishing is done and how it compares to other polishing methods. [Contents] ■ How is the polishing done? ■ How does it differ from other polishing methods? ■ What is the roughness of the finish? *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other abrasives
• Other surface treatment equipment

This document presents the purification performance test results of a prototype automotive exhaust gas purification device, which is formed in a honeycomb shape by layering a corrugated wire mesh made of SUS wire knitted in a jersey pattern and a plain woven wire mesh. Based on these results, two new products have been developed. These can be applied not only to automobiles but also to exhaust gas purification devices for construction machinery and generators. [Contents] ■ Performance test results of the prototype new automotive exhaust gas purification device made of SUS wire ■ Overview of new products - A product that combines a wire mesh knitted in a jersey pattern made of SUS wire with a metal steel foil plate - A product made of the same metal steel foil plate as existing products *For more details, please refer to the PDF document or feel free to contact us.

• others

Our company has developed various film polishing machines with the concepts of "high precision" and "environment" and has provided them both domestically in Japan and globally. Based on our technology, experience, and many years of achievements, we are a manufacturer that designs and manufactures according to customer requirements. Our external diameter polishing machines are mainly used in the final finishing and super finishing processes of various shafts for automotive parts, contributing to improved roughness and stable process capability values. 【Applications】 ◆ Balancer shafts ◆ Input/output shafts ◆ Compressor shafts ◆ Turbocharger shafts ◆ Medical devices, etc. The polishing capability of film polishing is said to be able to achieve a roughness that is approximately half of the previous roughness per process. For example, it is possible to reduce the roughness of a shaft with a previous roughness of Rz=1.6μm to below Rz=0.8μm in 15 seconds (see diagram). Additionally, since film polishing is a contour-following process, it can improve roughness without altering the original shape.

• Engine parts

Our company has developed various film polishing machines with the concepts of "high precision" and "environment" and has provided them both domestically in Japan and globally. We offer a variety of film polishing machines tailored to our customers' needs. Our internal diameter polishing machines are primarily introduced in the final finishing processes of various automotive parts, contributing to improved roughness and stable process capability values. 【Applications】 ◆ Oil pump covers ◆ CVT internal diameters ◆ Damper pulleys, etc. <Reasons why Sanshin's polishing machines are chosen> ■ A manufacturer specializing in film polishing machines with high technology ■ Customization (special jigs) available according to customer requests ■ Sample testing before introduction possible with various demo machines ■ Proposals for suitable polishing conditions based on processing know-how

• Engine parts

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and has provided them both domestically in Japan and globally. We offer a variety of film polishing machines tailored to our customers' needs. Our flat polishing machines are primarily introduced in the final finishing processes of automotive parts and electrical/electronic components, contributing to improved roughness and flatness. They also feature capabilities for controlled depth polishing through numerical control. 【Applications】 ◆ CVT inclined surfaces ◆ Valve lifters ◆ Engine valves ◆ Laminate substrate flattening (5G substrates, etc.) ◆ Cleaning smartphone glass ◆ Substrate flattening for the 5th generation mobile communication system (5G) ◆ Wafer edge polishing ◆ Fiber optic end face polishing, etc. ＜Reasons to Choose Sanshin's Polishing Machines＞ ■ Manufacturer specialized in film polishing equipment ■ Customization available to meet customer requests (special jigs) ■ Sample testing possible before introduction with various demo machines ■ Expertise in processing allows for recommendations of optimal polishing conditions.

• Engine parts
• Wafer
• lens

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and has provided them both domestically in Japan and globally. We offer a variety of film polishing machines tailored to our customers' needs. Our ball screw polishing machines are primarily introduced in the final finishing process of ball screw grooves for automotive parts, contributing to improved roughness and stable process capability values. 【Applications】 ◆ Electric power steering ◆ Worm shafts, etc. <Reasons to Choose Sanshin's Polishing Machines> ■ The only manufacturer in Japan specializing in film polishing machines ■ Customization (special jigs) available according to customer requests ■ Sample testing before installation possible with various demo machines ■ Proposals for optimal polishing conditions based on processing know-how

• Flight control parts
• Other machine elements
• Milling machine

Our company has developed various film polishing machines based on the concepts of "high precision" and "environment," and we have provided them both domestically in Japan and globally. We offer a variety of film polishing machines tailored to our customers' needs. Our spherical polishing machines are primarily introduced in the final finishing process of the spherical parts of hydraulic pistons and various pin heads related to construction machinery, contributing to improved roughness and stable process capability values. 【Applications】 ◆ Hydraulic pistons ◆ Ejector pin heads, etc. <Reasons to Choose Sanshin's Polishing Machines> ■ The only manufacturer in Japan specializing in film polishing machines ■ Customization (special jigs) available to meet customer requests ■ Sample testing before installation possible with various demo machines ■ Optimal polishing conditions can be proposed based on processing know-how

• Wafer
• Hydraulic Equipment

Our company has developed various film polishing machines with the concepts of "high precision" and "environment" and has provided them both domestically in Japan and globally. Based on our technology, experience, and long-standing achievements, we are a manufacturer that designs and manufactures according to customer requirements. Our outer diameter polishing machines are mainly introduced in the final finishing processes of various automotive parts such as crankshafts and camshafts, contributing to improved roughness and stable process capability values. 【Applications】 ◆ Cam and crankshafts for four-wheel vehicles ◆ Cam and crankshafts for two-wheel vehicles ◆ Cam and crankshafts for outboard motors, etc. The polishing capability of film polishing is said to be able to target a roughness that is about half of the previous roughness per process. For example, it is possible to reduce a shaft with a previous roughness of Rz=1.6μm to a roughness of Rz=0.8μm or less in 15 seconds. (Refer to the diagram) Additionally, since film polishing is a contour-following process, it is possible to improve roughness without altering the original shape.

• Engine parts

Are you having trouble improving surface roughness accuracy? Would you like to try the benefits of film polishing? You can polish quickly and easily without the hassle of the fine touch required in grinding with grinding wheels! 【For example, in the following cases】 ■ You want to improve roughness accuracy without worrying about changes in diameter or height dimensions. ■ You have performed grinding with grinding wheels, but it is still insufficient. – Final polishing is needed! ■ You want to finish with film polishing, skipping the grinding wheel process from the turning marks. ■ You want to roughen a surface that is too smooth. ■ You want to remove foreign substances attached to the surface. ■ You have tried various methods but they haven't worked well. ■ Polishing new materials or thin items seems unlikely to succeed without film polishing. *For more details, please request materials or view the PDF data from the download.

• Processing Contract

Sanshin Co., Ltd. is a manufacturer that designs and manufactures tape polishing machines based on technology, experience, and years of proven results, tailored to your needs. "The Collection of Case Studies on Sanshin's Film Polishing Technology" is a compilation of case studies on the film polishing technology handled by Sanshin Co., Ltd. It covers the basics of film polishing, the characteristics of Sanshin films, and the Sanshin technology that meets a wide variety of needs. We also introduce case studies from medical device manufacturers, automotive parts manufacturers, and electronic device manufacturers. ■ There is dirt after the final process, and strong cleaning agents cannot be used, making it impossible to remove the dirt... ■ We want to improve the roughness of the ball screw groove to reduce noise and enhance rolling performance. ■ We want to remove burrs that appear when making small holes in flat plates. Sanshin can solve these problems! 【Featured Case Studies】 ■ Medical Device Manufacturer - Proposed an outer diameter polishing device. ■ Automotive Parts Manufacturer - Proposed an inner diameter polishing device. - Proposed a ball screw polishing device. ■ Electronic Device Manufacturer - Proposed a flat surface polishing device. *We are currently accepting sample tests! For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other abrasives

We would like to introduce a case study proposed by Sanshin Corporation that addresses on-site issues. A certain medical device manufacturer had the concern that "the outer diameter of the pipes used in medical devices has dirt on it after the final process. Since it is for medical use, strong cleaning agents cannot be used, and the dirt cannot be removed." In response, we proposed our "outer diameter polishing device," which allows for the polishing of the workpiece's outer diameter. As a result, by changing the buff polishing process to film polishing, we were able to reduce the cleaning process. This improved the appearance of the finish and contributed to quality enhancement. 【Case Study】 ■ Issues - The outer diameter of the pipes used in medical devices has dirt on it after the final process. - Due to being for medical use, strong cleaning agents cannot be used, and the dirt cannot be removed. ■ Proposal - Introduced the "outer diameter polishing device" that allows for the polishing of the workpiece's outer diameter. - Conducted sample tests, and modifications to specifications according to customer requests are also possible. *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other abrasives

We would like to introduce a case study proposed by Sanshin Co., Ltd. that addresses on-site issues. A certain automobile manufacturer was looking to reduce friction in the inner diameter of bearing components in their transmission to improve fuel efficiency. In response, we proposed our "Inner Diameter Grinding Machine," which is capable of grinding the inner diameter of workpieces. As a result, performance evaluations showed that friction was reduced, leading to improved fuel efficiency, and they are considering the practical application of the device. 【Case Study】 ■Challenge - To reduce friction in the inner diameter of bearings and improve fuel efficiency. ■Proposal - Proposed the "Inner Diameter Grinding Machine," capable of grinding the inner diameter of workpieces. *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other abrasives

We would like to introduce a case study proposed by Sanshin Co., Ltd. that addresses on-site issues. A certain automotive parts manufacturer was looking to improve the roughness of their ball screw grooves to reduce noise and enhance rolling performance. In response, we proposed our "Ball Screw Grinding Machine," which is capable of film polishing the ball screw grooves. As a result, they were able to achieve noise reduction and improve the rolling performance of the balls. 【Case Study】 ■ Challenges - Improve the roughness of the ball screw grooves - Reduce noise - Enhance rolling performance ■ Proposal - Proposed the "Ball Screw Grinding Machine" *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Other abrasives

A tape grinding device utilized in high-tech industries such as automotive and electronics. Sanshin, a professional in tape grinding devices, will exhibit at "JIMTOF2018," starting on November 1. On the day of the event, we will demonstrate tape grinding for ball screws and worms used in electric power steering for automobiles. Additionally, we plan to unveil a newly developed outer diameter grinding device and a new technology for clogging suppression using ultrasonic vibrations. 【Event Overview】 JIMTOF2018 Date: November 1 (Thursday) to November 6 (Tuesday), 2018 Venue: Tokyo Big Sight, East Hall 1 (Booth Number: E1073) 【Exhibited Products】 ■ Newly developed! Outer diameter grinding device FPM-D ■ New technology! Grinding tape clogging suppression technology ■ Tabletop outer diameter grinding machine SFT-D1 ■ Outer diameter grinding unit SFM-25R (50R) / R・L ■ Inner diameter grinding unit MFIL-12 ■ Ball screw and worm gear grinding device BSN500-LM *For more details, please request materials or view the PDF data from the download section.

• Wafer processing/polishing equipment

We aim to correct the protrusions of various color filters and improve the flatness of the RGB surface. This method can absorb the warping of the glass substrate from the polishing tape side, achieving a uniform film thickness. Additionally, it is used to ensure the flatness of ribs in plasma displays and similar applications. Since it can be performed dry, cleaning is easy. Moreover, it is a device designed with inline considerations. 【Features】 ■ The surface roughness can be freely changed by replacing the tape. ■ The contact roller can closely adhere to the warping of the workpiece and perform polishing. ■ Since polishing is done from the high points of the workpiece, flatness is improved. *For more details, please request materials or view the PDF data available for download.

• Wafer processing/polishing equipment

As the performance and miniaturization of multilayer build-up substrates progress, increasingly stringent flattening processing is required. The FCMP-II series maximizes the characteristics of the wrapping tape, making it easy to achieve the desired polishing and simplifying equipment management. It enables polishing with minimal hole formation. By selecting the appropriate tape gauge, roughness management becomes easy, and it can be used for both wet and dry applications. Once set up, anyone can use it easily. For more details, please contact us or refer to the catalog.

• Wafer processing/polishing equipment

The color filter protrusion correction device corrects protrusion defects on color filters. Using the protrusion height measurement system of this device, protrusions are polished to the allowable height through point grinding correction. It is also possible to automate the process by connecting an inspection device. In that case, based on the protrusion data, protrusion confirmation is performed, the shape of the protrusion is recognized, the polishing center position is corrected, and protrusion correction is reliably carried out. It is also possible to add a retry function. For more details, please contact us or refer to the catalog.

• Wafer processing/polishing equipment

The tape-type centerless ultra-finish grinding machine CLP-300 enables management of roughness below 0.4z through tape grinding. There is no need for troublesome dressing work. With a setup change time of less than 5 minutes, it is ideal for a variety of products in small lots. Its main applications include various straight shafts for automobiles and construction machinery, motor shafts (single shafts), rollers for printers (rubber, resin, metal), and inspection pin gauges. If you would like to request a sample test, please feel free to contact us! For more details, please inquire or refer to the catalog.

• Wafer processing/polishing equipment

"MFIL" is a unit for precision grinding the inner diameters of various bushes and similar components. It can be attached to lathes and other machines for precision processing. By simply replacing the grinding film, you can achieve the desired surface accuracy according to your needs. Additionally, since it grinds while feeding the tape, it can consistently finish with a fresh abrasive surface. 【Features】 ■ Achieves surface accuracy according to the purpose ■ Capable of precision finishing on inner diameters, outer diameters, and tapered sections ■ Allows for precision finishing regardless of experience level ■ Consistently finishes with a fresh abrasive surface ■ Usable for both dry and wet processes while maintaining a clean and compact working environment *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "SFBS-UN" is a grinding unit specifically designed for ball screws and external diameter screw grooves. The vertical mechanism improves the uniformity of the finish on both sides of the screw grooves. It is capable of achieving surface precision of Ra 0.1 to 0.05, which was not possible with conventional methods. Additionally, by feeding the tape while grinding, it can consistently finish with a new abrasive surface. 【Features】 ■ Improved uniformity of the finish on both sides of the screw grooves due to the vertical mechanism ■ Achieves surface precision of Ra 0.1 to 0.05, which was not possible with conventional methods ■ Surface precision improves in a short time, allowing for a uniform surface finish ■ Consistently finishes with a new abrasive surface ■ Unlike manual grinding, it is not significantly affected by the operator's experience *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "Liquid Crystal Panel Double-Sided Cleaning Device" can remove dirt adhered to the surface of the liquid crystal substrate (panel) using tape. The substrate flowing on the conveyor from the previous process is sandwiched between upper and lower cleaning tapes, and by moving the tape left and right, cleaning is performed on both sides simultaneously. Additionally, by changing the tape, it can also be used for polishing the substrate surface. 【Features】 ■ Since the liquid crystal substrate is cleaned on both sides simultaneously, no inversion device is required. ■ Stubborn dirt can also be cleaned with a 2-head system (special specification). ■ By narrowing the tape width, consumable costs are reduced. ■ By changing the tape, it can also be used for polishing the substrate surface. *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment
• Circuit board processing machine

The "Point Polishing Unit" is a unit that repairs the protruding parts of liquid crystal color filters using polishing tape. It receives polishing conditions from the upper controller and operates based on those conditions. The substrate surface detection sensor detects the surface of the substrate and stops the polishing head. Furthermore, this product can control the polishing area by changing the special polishing pad. 【Features】 ■ The polishing area can be controlled by changing the special polishing pad. ■ Pressure can be controlled to avoid damaging the panel. *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

The "Shaft Journal Grinding Device" grinds the bearing part (outer diameter) of the shaft using a wrapping tape, removes burrs from other processed areas with a brush, and blows away coolant drips from the shaft grinding area using air blow. The supply and discharge of the workpiece are done using a gantry loader, which is optional. 【Features】 ■ Reduction in total cost ■ Compatibility with various workpiece types can be selected via a touch panel recipe ■ Provides satisfactory values by selecting the wrapping tape (Please consult us regarding the roughness of the pre-processing) ■ Supply of outer diameter tape wrap units is also possible (unit sales) *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "Internal/External Diameter Lapping Device" can polish and finish the inner diameter of collars and the outer diameter of bosses with grooves using lapping tape. The attachment and detachment of the workpiece is performed by the operator, while the opening and closing of the door, workpiece chucking/unchucking, and processing are carried out automatically by a semi-automatic machine. The contact part (the area polished with tape) is developed uniquely by our company (patented), making the tape routing easy. 【Features】 ■ Easy tape routing due to our unique development (patented) ■ The device's width is minimized, making it suitable for processes with multiple machines ■ Vertical design requires less floor space ■ Proven results with tape lapping, eliminating the grinding process *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

The "Stamping Back Surface Polishing Device" can polish the back surface of a stamper using a wrapping film. The clamping (fixing) and unclamping (removal) of the workpiece is performed by the operator, while roll polishing, pad polishing, brush cleaning, and air blowing are done automatically. Various surface roughness requirements from different companies can be accommodated by selecting the appropriate wrapping tape and adjusting the parameters of the device to enable processing under optimal conditions. 【Features】 ■ It is possible to randomize the circumference of roll polishing with pad polishing. ■ Once the conditions are set, even beginners can operate it easily. *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment

The "Thin Plate Flat Grinding Device" performs flat grinding using a lapping film (grinding tape). The workpiece can be attached and detached by the operator, and it can automatically grind the specified area. It is effective for grinding various substrates and for removing fine burrs from punched parts. 【Features】 ■ Film width can be selected based on the workpiece (supports two types) ■ Achieves high efficiency and low-cost processing ■ Effective for grinding various substrates and for removing fine burrs from punched parts ■ If a sub-table is provided, external setup can be done during processing time *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment

This product is a device designed to improve the surface roughness of spherical parts using a tape polishing machine. The supply to the in-machine jig is performed by the operator, and the processing is done automatically via a start switch, making it a semi-automatic machine from which the operator retrieves the finished product. Additionally, the width of the polishing film can be selected based on the workpiece, enabling high efficiency and low-cost processing. 【Features】 ■ Capable of controlling roughness below Ra0.1μm ■ The width of the polishing film can be selected based on the workpiece ■ Achieves high efficiency and low-cost processing ■ Partial R polishing is also possible *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment

This product is a needle valve deburring and outer diameter tape wrapping device. It is an automatic machine that inline takes in workpieces from the supply pallet, deburrs and cleans them with a brush, performs outer circumference tape wrapping and tip radius tape wrapping, and then sets them onto the discharge pallet. 【Features】 ■ Equipped with a brush process within the device ■ Identifies valve seats and sequentially discharges them onto the pallet along with the needle valves *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment

The "Cam Wrap Device" can perform deburring of the cam outer peripheral edge of the camshaft and finish the cam section with tape wrapping. The supply to the in-machine jig is done by the operator, and processing is automatically carried out by the activation switch, with discharge through a chute, making it a semi-automatic machine from which the operator retrieves the finished product. The backup roller of the tape unit follows the shape of the cam through a mechanism driven by a servo motor, ensuring that the shape is not distorted. 【Features】 ■ Equipped with a mechanism that follows the shape using a servo motor, preventing distortion ■ Capable of adjusting parameters such as tape, processing time, and pressure ■ A combined device for tape polishing and brushing, offered at a reasonable price *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment

The "MH-200L" is a curved polishing device developed for curved wrapping. By changing the jig according to the workpiece being processed, ultra-finishing can be achieved with tape wrapping without altering the previous shape. It is a tabletop model that is easy to move. Once the jig is set, anyone can easily perform the work. 【Features】 ■ Easy to move as a tabletop model ■ Once the jig is set, anyone can easily perform the work ■ Achieves precision that cannot be stabilized by hand ■ Ensures improved yield *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment

This product is a device for polishing the upper surface of ribbed substrates. Until now, tape backup was performed using the pressing force of rollers, but we have introduced a Z-axis and adopted a mechanism that does not damage the workpiece. Polishing is done using a dry method. The workpiece is attached and detached by the operator, and the predetermined cycle is performed automatically in a semi-automatic machine. 【Features】 ■ Capable of Z-axis control, preventing damage to the initial polishing area ■ Adoption of a flat pad avoids concentrated loads, allowing for soft-touch polishing ■ Once set up, anyone can easily use it *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment

The "SCL-3SS" is a device that cuts the outer diameter of a micro motor's commutator using a special shaving bit, and deburrs it with a brush after cutting. It is a semi-automatic machine that sets the workpiece on a diamond V block and executes the cutting cycle when the start button is pressed. It accommodates shaft diameters of φ2.3 to φ4, core outer diameters of φ20 to φ36, and commutator outer diameters of φ6 to φ16. 【Features】 ■ Can accommodate slight differences in shaft length ■ Allows for changes in cutting speed through simple operation to achieve the desired surface roughness ■ Reduces downtime by performing rough and finish machining within the same device using a two-stage cutting mechanism ■ Enables cutting feed settings via servo * There is also a fully automatic cutting machine available in-line. Please refer to the SCL-7WBA for more details. * For more information, please refer to the PDF document or feel free to contact us.

• Other processing machines
• Wafer processing/polishing equipment