サトーセン Company Profile

Business Activities

**Main Business** - Manufacturing of industrial printed circuit boards **Technology Introduction** - With high-density and fine processing technology, we excel in high-precision mounting for narrow pitch BGA, build-up, IVH, BVH, and flat plugs. Additionally, we can perform contour processing tailored to the pattern's position. - We provide surface treatments suitable for COB (Chip on Board) technology, along with electroplated gold bonding without leads. - Our high brightness and heat dissipation technology includes reflector processing, surface treatments tailored to LED wavelengths, and heat dissipation substrates that maintain junction temperatures at appropriate levels. - Our miniaturization and thinness technology enables rigid-flex designs, allowing for space-saving and cost reduction. We can accommodate mobile devices with ultra-thin board thicknesses of 0.04 mm. - Our high-frequency technology optimizes material selection, layer composition, circuit design, and impedance control to achieve the desired characteristics for high-speed transmission. - We prevent leakage of sealing resin and flow into through-holes with dam technology. - Our dust prevention technology reduces fuzziness and burrs on the outer edge surfaces using special molds.

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