カネモト精工 List of Products and Services

At Kanemoto Seiko Co., Ltd., we handle the processing of quartz, crystal, optical glass, ceramics, silicon, magnets, and single crystals. Our grinding and cutting with free abrasive grains allows for cutting without damaging the workpiece and is suitable for various materials. We can achieve processing accuracy of up to ±0.003 through lapping. For more details, please contact us or refer to our catalog.

• Processing Contract
• Glass
• Ceramics

Kanemoto Seiko Co., Ltd. specializes in cutting and processing quartz glass, silicon, and ceramics, particularly excelling in slicing large workpieces. With the introduction of ultra-large wire saws, we can slice workpieces up to 1100 mm × 1000 mm × 350 mm with a thickness tolerance of ±0.04 and flatness of 0.04 or less. Additionally, the introduction of ultra-large diamond saws allows for external processing and slicing of workpieces up to 1000 mm in height and 1000 mm in width. Our multi-blade saw can also slice workpieces measuring 400 mm × 400 mm × 400 mm to a thickness of over 10 mm. For more details, please contact us or refer to our catalog.

• Processing Contract
• Glass
• Ceramics