ダイゾー List of Products and Services

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RFID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

The NIC BOND 3000 series is the ideal adhesive for optical devices that require high reliability. The NIC BOND 3000 series is designed for high-performance optical devices and is available in small, optimal packaging. ⚫︎ It is effective for the assembly of ferrules and fibers for optical single module connector assembly. ⚫︎ With a diverse lineup, it can accommodate plastic fibers, multi-core, single-core, bundles, and more. Our NB3000 series meets the needs for bundles and single module assembly. ⚫︎ The diverse lineup allows compatibility with a wide range of optical devices. Our NB3000 series meets the requirements for any optical device. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste this into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

The NIC BOND 7000 series is for interconnection of large ICs to small ICs, substrates, and modules.

- Suitable for various applications in high-temperature environments. For Any High Temp Operating Devices. High Tg, Low Out Gas, Reflow Resistant, Environmental Resistance Uniq Characters: High Tg, Low absorption, Low Outgas, Reflow Resistant Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

NB9000 Series for IPX Level 7 Standard An epoxy resin adhesive that demonstrates rubber elasticity and achieves rubber extensibility (200%). It exhibits the high reliability characteristic of epoxy resin, shows better heat resistance than rubber (silicone, urethane), and performs sufficiently even at extremely low temperatures. It also meets the waterproof standard of IPX Level 7. Flexibility, Elasticity, Extend like Rubber with higher performance Silicon Rubber. Premium Elasticity Epoxy Adhesive. NB9000 Series passed IPX Level 7 Standard. Direct contact information for Nichimoly HP If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

This is an adhesive with a long track record in hard disk drive assembly. Characteristics: Low outgassing, low-temperature curing, oil-resistant, halogen-free. NIC BOND (part number): NB3040 (two-component), NB3041B (one-component) Syringe, TNB-6322HF. High Quality High Performance for HDD Drive Assembly. Characteristic: Halogen Free, Low Out Gas, Low Temp Cure, Oil Resistant. For direct inquiries to Nichimoly HP, if you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html.

This package service reduces the risk of adhesive troubles, waste, and inventory management through acceptance inspection agency, shipping inspection implementation, and disposable package agency for our customers. It not only simplifies on-site inventory management but also helps alleviate concerns and reduce environmental pollution. Additionally, it eliminates the need for equipment such as scales and filling machines, contributing to a reduction in asset management costs. For direct inquiries to Nichimori HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

This is a waterproof and dustproof adhesive made from 100% epoxy resin, demonstrating premium flexibility with a 200% elongation rate, suitable for use in environments ranging from extreme cold to high temperatures. For direct inquiries to Nichimori HP, please copy and paste the following link into your browser: https://www.daizo.co.jp/nichimoly/contact_form.html

NIC BOND NB4000, 6000 Series Meets the requirements for die bonding in electrical insulation applications, high reliability, workability, and thermal conductivity. High Performance, Thermal Conductive, Non-conductive Epoxy Adhesives. Direct contact information for Nichimoly If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

We will provide free samples of various adhesives with conductivity, insulation, halogen-free, heat dissipation, heat resistance, and ultra-flexibility.

Growing rapidly!? Over 200% growth rate!? We are currently giving away samples of our super flexible epoxy adhesive to 30 lucky winners through a lottery! The NICBOND sample in this giveaway is our self-developed adhesive, a culmination of years of experience and accumulated knowledge in applied chemistry. In addition to our standard lineup products that cater to a wide range of applications, we also offer bespoke solutions tailored to meet the specific needs of our customers. We have samples available for various adhesives including conductive, insulating, halogen-free, heat-dissipating, heat-resistant, and super flexible types. These can be applied to devices requiring a wide range of functionalities such as conductive applications, heat dissipation, device assembly, motor assembly, and connector assembly. *If you would like a sample, please feel free to contact us through the inquiry form. Additionally, for those who want to read before selection! Download our free case study collection on adhesives! We highly recommend it. [Contents Included] - Optical adhesives/UV-curable adhesives - Insulating heat-dissipating adhesives - Conductive adhesives

We deliver NIC BOND products that comply with halogen-free standards, which started as part of our environmental initiatives in 2007, along with data guarantees. These products are suitable for a wide range of applications, including module assembly and the adhesion of electronic components. Our NIC BOND meets Halogen Free Standards of IEC, IPC, and JPCA. We provide data on halogen. For direct inquiries to Nichimoly HP, please copy and paste the following link into your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

A must-read before selecting adhesives! This is a collection of adhesive case studies that can be read in just 10 minutes. It clearly explains various aspects of optical, thermally conductive, and conductive adhesives. NICBOND is our self-developed adhesive, a culmination of applied chemistry knowledge accumulated over many years of experience. We offer not only a standard lineup of products that can meet a wide range of applications but also bespoke solutions tailored to each customer's needs. [Contents] ○ Optical adhesives / UV-curable adhesives ○ Thermally conductive adhesives ○ Conductive adhesives For more details, please contact us or download the catalog.

In "The Manual for Super Flexible Epoxy Adhesive," we introduce products like the Super Flexible Epoxy Adhesive NIC BOND. It includes a Q&A section to solve your adhesive-related problems. Additionally, we feature a diverse lineup suitable for various applications. [Contents] ■ What is the Super Flexible Epoxy Adhesive NIC BOND? ■ Examples of its impressive stretchability ■ What adhesive-related issues do you have? ■ A lineup of 50 types for different applications ■ Product overview and applications, among others *For more details, please refer to the catalog or feel free to contact us.

The warm water peelable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily peeled off with warm water at temperatures between 60°C and 80°C. It is an epoxy-based adhesive that cures at room temperature to low temperatures, and after curing, it has adhesive strength equivalent to that of standard epoxy resin adhesives. It is expected to be useful for temporary bonding applications during the processing of materials that are difficult to peel off after bonding, such as "silicone ingots, sapphire, glass, neodymium-based magnetic materials, and semiconductors." 【Features】 ■ Cures at room temperature ■ High strength epoxy adhesive ■ Peels off in warm water (60-80°C) in 30 minutes ■ Does not use lactic acid, alkaline acids, or other chemicals *For more details, please refer to the catalog or feel free to contact us.

In the "User Manual for Super Flexible Epoxy Adhesive," we introduce products such as the super flexible epoxy adhesive NIC BOND. The warm water removable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily removed with warm water at temperatures between 60°C and 80°C. The catalog features the characteristics of super flexible epoxy, case studies, and a lineup of adhesives for various applications, as well as the features and basic properties of warm water removable epoxy adhesives, along with test photos. [Contents] ■ Stretchable Epoxy What is super flexible epoxy adhesive? Includes a Q&A section to solve your past adhesive problems. Additionally, a diverse lineup for various applications is also featured! ■ Removable Epoxy The warm water removable epoxy adhesive "NIC BOND NB10000" is a temporary adhesive that can be easily removed with warm water at temperatures between 60°C and 80°C. *For more details, please refer to the PDF or feel free to contact us.