ヨーホー電子 List of Products and Services

At Yoho Electronics, we focus on PCB assembly and respond to our customers' diverse requests (short delivery times, low costs, small quantities of various types, mass production). In surface (SMT) mounting, we achieve a precision with chip sizes of 0402, lead spacing of 0.3mm, and adjacent pitch of 0.1mm. The compatible chips include BGA, QFN, SOP, QFP, and LED, among others. The maximum size we accommodate is 250mm x 330mm, with board thicknesses ranging from 0.5mm to 3.0mm. 【Mounting Capability and Precision】 <Surface (SMT) Mounting> ■ Precision - Chip Size: 0402 - Lead Spacing: 0.3mm - Adjacent Pitch: 0.1mm ■ Compatible Chips: BGA, QFN, SOP, QFP, LED, etc. ■ Compatible Sizes - Maximum Size: 250mm x 330mm - Board Thickness: 0.5mm to 3.0mm *For more details, please refer to the PDF document or feel free to contact us.

At Yoho Electronics, we achieve high product quality and reduced lead times through a consistent production system, unique manufacturing technology, and a quality control framework. The supported substrates include double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), and ceramic boards. By molding (resin encapsulation) the assembled boards, we enhance performance in heat dissipation, dust resistance, and drip resistance, ensuring the reliability of the assembled boards. In addition to molding, we can also accommodate substrate coating. 【Products and Services】 <Supported Substrates> ■ Double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), ceramic boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

Our company provides a comprehensive service from artwork design to implementation and assembly. We can flexibly respond to delivery times (short delivery times) as we can produce prototypes, small quantities of various products, and mass production products in parallel. We can also handle assembly and inspection work only, with the printed circuit boards supplied. In addition to electronic components, we can procure molded products, sheet metal, harnesses, film sheets, and more. 【Features】 ■ Comprehensive service from artwork design to implementation and assembly ■ Ability to produce prototypes, small quantities of various products, and mass production products in parallel ■ Flexible response to delivery times (short delivery times) ■ Capable of handling high-density chip mounting as well as boards with many lead components ■ Can handle assembly and inspection work only with printed circuit boards supplied ■ Procurement of molded products, sheet metal, harnesses, film sheets, etc., in addition to electronic components *For more details, please refer to the PDF document or feel free to contact us.

At Yoho Electronics, we create new value together with our customers through various circuit board assembly and manufacturing processes. ● We can handle consistent manufacturing from circuit/mechanical design, prototyping, mass production, to final product assembly. ● We are also capable of accommodating requests for short delivery times, small quantities of diverse products, and manual soldering. We have a wide range of experience in manufacturing products related to semiconductor manufacturing equipment, communication devices, industrial products, and consumer goods. In surface mount technology (SMT), we achieve a chip size of 0402, a lead pitch of 0.3mm, and an adjacent pitch of 0.1mm precision. Supported chip types include BGA, QFN, SOP, QFP, and LED. The maximum size we can handle is 850mm x 500mm, with board thickness ranging from 0.5mm to 3.0mm. 【Mounting Capability and Precision】 <Surface Mount Technology (SMT)> ■ Precision - Chip Size: 0402 - Lead Pitch: 0.3mm - Adjacent Pitch: 0.1mm ■ Supported Chips: BGA, QFN, SOP, QFP, LED, etc. ■ Supported Sizes - Maximum Size: 850mm x 500mm - Board Thickness: 0.5mm to 3.0mm *For more details, please refer to the PDF document or feel free to contact us.

Through software and hardware design to circuit board assembly and product assembly, we create new value together with our customers. Based on our unique development and assembly know-how, we respond to various requests such as development, component procurement, discrete assembly, surface mount assembly, product assembly, and various inspections. In design, we focus on ease of manufacturing by utilizing our assembly know-how. In assembly, we accommodate various circuit board implementations, including small high-density boards, large control boards, and power supply boards. We have established our own quality control and delivery management, providing speedy service. ◆ Circuit Design: Supports analog and digital circuit design. CAD used: QuadCept, PADS, Altium Designer ◆ Software Design: Supports microcontroller software and applications (APP). Microcontroller software development achievements: Renesas, PIC, Infineon, STM, NXP, etc. APP development achievements: Android OS, iOS ◆ Mechanical Design: Capable of consistent support from prototypes to mass production. We own a large 3D printer and can accommodate prototype models up to 300×250×250mm.

Our company offers a one-stop solution from software development to printed circuit board assembly. By starting with software development, we shorten the product development period and design with consideration for ease of manufacturing. In addition to product development and manufacturing, we also create production tools (inspection equipment) to comprehensively support production. 【Features】 ■ We turn your ideas and images into tangible product proposals. ■ We can coordinate design tasks such as circuit, software, PCB, and mechanical design comprehensively. ■ We incorporate manufacturing department know-how in a timely manner, designing with "ease of manufacturing" in mind. ■ Proposals for alternatives to hard-to-obtain or discontinued parts. ■ We can also design production tools leveraging our experience in manufacturing. *For more details, please download the PDF or feel free to contact us.