大英エレクトロニクス List of Products and Services

3D-MID refers to molded circuit components that directly incorporate wiring into plastic injection molded products. By three-dimensional wiring of the housing as part of the printed circuit board, it enables the miniaturization, thinness, lightweight, and enhancement of product functionality. Currently, there are mainly two types of methods for 3D-MID: the two-shot molding method and the laser method. Within these two types, there are several additional techniques. 【Features of MID】 - Direct wiring and component mounting on the housing enable miniaturization, thinness, and lightweight design. - Reduction in the number of components (material savings). - Reduction in assembly labor. - Cost reduction due to the decrease in the number of components and assembly labor. - By combining printed circuit boards with 3D-MID, it addresses the high-density products that cannot be managed by printed circuit boards alone. *For more details, please refer to the related links or feel free to contact us.

• Other CAD
• Other contract services

At Daiei Electronics Co., Ltd., we design circuit molded parts called "MID," where electrical circuit patterns are formed on resin injection molded products. We have introduced MECADTRON's "NEXTRA" as a MID design CAD tool to accommodate MID products with complex wiring patterns. Moving forward, our goal is to understand various MID manufacturing methods to enhance the reliability of circuit molded parts and to establish MID design planning that aligns with 3D component mounting conditions. *For more details, please download the PDF or contact us.*

• Other CAD
• Other contract services