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アクアス

capital9000Ten thousand
number of employees80
addressAichi/Naka-ku, Nagoya-shi/1-25-35 Sakae
phone052-220-5571
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last updated:Jan 03, 2025
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LED lighting LED lighting
Forced air cooling heat sink ALUTRONIC (Germany) Forced air cooling heat sink ALUTRONIC (Germany)
ALUTRONIC (Germany) standard aluminum heat sink ALUTRONIC (Germany) standard aluminum heat sink
ALUTRONIC (Germany) Pure Aluminum Pin Heat Sink ALUTRONIC (Germany) Pure Aluminum Pin Heat Sink
Fan-equipped heat sink ALUTRONIC (Germany) Fan-equipped heat sink ALUTRONIC (Germany)
ALUTRONIC (Germany) Heat sink for PCB mounting ALUTRONIC (Germany) Heat sink for PCB mounting
Pin header socket 1.27mm pitch Pin header socket 1.27mm pitch
Cooling devices "Heat Sink" and "Fan" from JARO Corporation, USA. Cooling devices "Heat Sink" and "Fan" from JARO Corporation, USA.
UL180/182 Adjustable Monitor Arm Wall Mount UL180/182 Adjustable Monitor Arm Wall Mount
UL550 Series Horizontal Movable Monitor Arm UL550 Series Horizontal Movable Monitor Arm
Ceiling-mounted monitor arm Ceiling-mounted monitor arm
ICWUSA Long Monitor Arm ICWUSA Long Monitor Arm
Wall-mounted display arm Wall-mounted display arm
Wall-mounted workstation arm Wall-mounted workstation arm
Laptop arm Laptop arm
Slide-type wall track mount monitor arm Slide-type wall track mount monitor arm
EV65 Series Horizontal Adjustable Monitor Arm EV65 Series Horizontal Adjustable Monitor Arm
Support pillar installation workstation Support pillar installation workstation
Medical monitor arm Medical monitor arm
Medical cart and roll stand Medical cart and roll stand
Aceluxe Korean-made desk mount monitor arm Aceluxe Korean-made desk mount monitor arm
Heat sink for surface mount devices, made by Fischer in Germany. Heat sink for surface mount devices, made by Fischer in Germany.
Fischer Elektronik manufactured SMT heat sink Fischer Elektronik manufactured SMT heat sink
Axial fan-equipped heat sink Fischer Elektronik Axial fan-equipped heat sink Fischer Elektronik
High-performance heat sink for forced air cooling High-performance heat sink for forced air cooling
Extruded heat sink Fischer Elektronik Extruded heat sink Fischer Elektronik
Pin Fin Heat Sink Fischer Elektronik Pin Fin Heat Sink Fischer Elektronik
Extruded heat sink for clip mount Fischer Extruded heat sink for clip mount Fischer
Transistor fixing spring clip Transistor fixing spring clip
Fischer Elektronik Co. Electronic Components Fischer Elektronik Co. Electronic Components
Surface mount pin header/socket 2.54mm pitch Surface mount pin header/socket 2.54mm pitch
Surface mount pin header/socket 2mm pitch Surface mount pin header/socket 2mm pitch
Through-hole pin header and socket, 2.54mm pitch Through-hole pin header and socket, 2.54mm pitch
Fivetech Corporation's circuit board hardware Fivetech Corporation's circuit board hardware
Virus infection prevention products Virus infection prevention products
LED lighting construction achievements LED lighting construction achievements
Heat-insulating sheet / Glass coat Heat-insulating sheet / Glass coat
Monitor arm Monitor arm
Monitor arm (wall-mounted) Monitor arm (wall-mounted)
Monitor arm (pole mount) Monitor arm (pole mount)
Monitor arm (desk) Monitor arm (desk)
Bipolar transistor Bipolar transistor
Diode Diode
MOSFET MOSFET
Dual compound semiconductor Dual compound semiconductor
ALUTRONIC

ALUTRONIC (Germany) Heat sink for PCB mounting

The Alutronic PCB heat sinks come in approximately 200 types, and you can choose from screw-mounted, soldered, and clip types according to your application.

Heat sink soldering TO-220 package Al99.5

Aluminum heat sink for TO-220 package that can be soldered to PCB substrate.

At Aqua Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which possesses high processing and surface treatment technologies. The "FI 308/SN" is a TO-220 package heat sink for semiconductors made of Al99.5 material with a tin plating surface treatment. It can be soldered to a PCB board at the pin section. The semiconductor is attached to this product with screws.

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Heat sink, transistor clip, board mounting, board installation.

Aluminum heat sink that can be attached with clips for TO-220, TO-218, and TOP-3 package semiconductors.

At AquaS Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which has high processing and surface treatment technology. "PR 101/94/SE" Dimensions: W6mm H50mm L94mm Material: AlMgSi0.5 Surface treatment: Black anodized This product can be fixed to a PCB board with screws. The semiconductor can be attached to this product using a separately sold clip. *Please refer to our company's website at the linked page for compatible clips. *Custom lengths can be manufactured.

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Heat sink for substrate mounting, compatible with semiconductor clip mount.

Aluminum extruded heat sink that can securely hold TO220, TO218, and TO3P case semiconductors with clips.

At Aqua Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which possesses high processing and surface treatment technology. "PR 116/94/SE" Dimensions: W30mm H31mm L94mm Material: AlMgSi0.5 Surface treatment: Black anodizing This product can be fixed to the PCB substrate with screws. The semiconductor can be attached to this product using a separately sold clip. *Please refer to our website linked for compatible clips. *Custom lengths can be manufactured.

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Heat sink for TO-220 package semiconductors Al99.5

Screw-mounted TO-220 package semiconductor made of pure aluminum (Al99.5) with black anodizing.

At Aquas Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which has high processing and surface treatment technology. "FI 356/SE" Material: Al99.5 Surface treatment: Black anodizing Minimum thermal resistance [K/W]: 9.0 This is a heat sink for TO-220 package semiconductors. The semiconductor is attached to this product with screws.

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TO220, SOT32 package semiconductor heat sink

Heat sink for mounting on a circuit board that can accommodate SOT32 (TO126) and TO220 package semiconductors.

At Aquas Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which has high processing and surface treatment technologies. "FI 351/30/SN" Material: Al99.5 Surface treatment: Tin plating Minimum thermal resistance [K/W]: 17.0 The semiconductor is attached to this product with screws.

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Heat sink for substrate mounting, semiconductor clip mount

Standard aluminum heat sink that can securely hold TO220 and TO218 (TOP3) package semiconductors with clips.

At AquaS Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which has high processing and surface treatment technology. Semiconductor package: TO-220; TO-218; TOP-3 Semiconductor mounting: Clip mount Heat sink installation: Screw-in type Surface treatment: Black anodized Material: AlMgSi0.5 Width [mm]: 50.0 Height [mm]: 28.0 Length [mm]: 94.0 Minimum thermal resistance [K/W]: 3.0 This product can be fixed to the PCB board with screws. The semiconductor is mounted to this product using a separately sold clip. *Please refer to our website linked for compatible clips. *Custom lengths can be manufactured.

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Semiconductor Mounting Clip for TO-220 Package

You can securely attach a TO-220 package semiconductor without screws to an aluminum heat sink compatible with separately sold clip mounts!

At Aquaus Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which has high processing and surface treatment technology for aluminum heat sinks. Semiconductor package: TO-220 Semiconductor mounting method: Clip mount Color: Black Material: Spring steel - Material: Spring steel (C75) - Surface: Bluing - Width: 9.1 mm Please refer to the link for available aluminum heat sinks.

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Top mount pressure contact heat sink

The contact thermal resistance (RthGK) to the primary heat sink is reduced due to the overall contact pressure, avoiding "hot spots."

At Aqua Co., Ltd., we are an authorized distributor of Altronic GmbH (Germany), which possesses high processing and surface treatment technology. Top-mounted and contact pressure heat sinks for optimal contact pressure and additional cooling - Full contact pressure reduces the contact thermal resistance (RthGK) to the primary heat sink, avoiding "hot spots" - Additional heat transfer reduces the overall thermal resistance (Rth)

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