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Our company handles "solder ball mounting devices." The ceramic substrate mounted on the transport carrier is removed, followed by solder paste printing, solder ball mounting, and quality inspection through image processing. After that, it is mounted on a pallet for reflow and discharged for reflow. Additionally, we can customize according to your requests. Please contact us when you need assistance. 【Specifications】 ■ Ceramic substrate size: 19mm × 12mm × 0.8mm ■ Mounted solder ball: diameter 0.65mm ■ Number of solder balls mounted: 112 pieces ■ Mounting accuracy: ±0.05mm ■ Cycle time: 24 seconds (2 boards) 12 seconds/1 board *For more details, please refer to the PDF document or feel free to contact us.
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Free membership registrationAd Machinery Design is a specialized contractor for various mechanical design and manufacturing, as well as the development of robots and automated machines, responding to the needs of customer management strategies and the design and development department.
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