味の素ファインテクノ List of Products and Services

Plenact is a general term for Ajinomoto Fine-Techno's coupling agents, which can be broadly classified into titanate and aluminate types. It has the property of chemically bonding to the surface of inorganic materials at room temperature, forming an organic coating. Unlike silane coupling agents, it can be processed without hydrolysis. It significantly contributes to improving dispersibility, adhesion, imparting flexibility in composite materials, and enhancing flow properties, making it suitable for various applications. 【Features】 ■ Broadly classified into titanate and aluminate types ■ By modifying the surface of inorganic fillers with Plenact, the affinity with the organic matrix is improved *For more details, please refer to the related links or feel free to contact us.

• Bio-related products, cleaning agents, maintenance and consumables

"Plenact" is a general term for the coupling agents from Ajinomoto Fine-Techno, which can be broadly categorized into titanate and aluminate types. By modifying the surface of inorganic fillers with Plenact, the affinity with the organic matrix is improved. It is used in various fields for improving viscosity during filler filling and enhancing the mechanical properties of resin materials. [Features] ■ The dispersant covers the surface of the powder, reducing surface activity and improving wettability between the powder, resin, and solvent. ■ The three-dimensional barrier formed by the dispersant prevents agglomeration. *For more details, please refer to the related links or feel free to contact us.

• Bio-related products, cleaning agents, maintenance and consumables

"Ajisupa" is a polymer-based dispersant developed independently by AFT, based on the interfacial chemistry technology cultivated over many years by the Ajinomoto Group, which allows for the easy high dispersion of various nano-fillers. The polymer-based dispersant consists of pigment adsorption bases and hydrophilic solvent/resin sites. The hydrophilic solvent/resin sites are polymer chains that prevent pigment aggregation after dispersion due to steric repulsion between the polymer chains. [Functions and Features] ■ Enables hard dispersion and stabilization of dispersion through a simple process ■ Improved compatibility and wettability ■ Enhanced properties in composite materials *For more details, please download the PDF or feel free to contact us.

• Cell dispersion reagent

"Ajisupa" is a polymer-based dispersant that easily disperses various nano-fillers developed independently by AFT, based on the interfacial chemistry technology cultivated over many years by the Ajinomoto Group. The polymer-based dispersant consists of pigment adsorption sites and polar solvent/resin sites. The polar solvent/resin sites are polymer chains, which can prevent pigment aggregation due to steric repulsion between the polymer chains after dispersion. [Applications] ■ For organic ink applications ■ Uniform dispersion of pigments into resins, solvents, etc. ■ Viscosity reduction of formulations with high filler loading *For more details, please download the PDF or feel free to contact us.

• Cell dispersion reagent

- Temporary fixation is possible with UV irradiation, allowing for active alignment. - Areas not exposed to UV can be treated later with heat: 3000mJ/cm² + 80°C for 30 minutes. - The cured material becomes a low-elasticity body, excelling in adhesion, stress relaxation, and impact resistance. - The low viscosity allows for easy penetration during dispensing.

• Other polymer materials

Amicure is a latent curing agent and curing accelerator for one-component epoxy resin developed by Ajinomoto Fine-Techno Co., Inc. It is widely used overseas under the name AJICURE. It is applied in various fields such as the adhesion of electronic components, automotive parts, powder coatings, and composite materials like prepregs. 【Are you facing any of these issues?】 - You are using a two-component epoxy resin but want to simplify the process by switching to a one-component solution. - You want to achieve and improve both low-temperature curing and pot life. - You want to solve challenges related to curing properties, storage stability, and adhesion required for one-component curing agents and curing accelerators. 【Features】 - Effective in achieving both low-temperature curing and pot life. - Excellent stability that allows for heating mixing with high-viscosity resins and the use of heated formulations. - Demonstrates excellent effectiveness as a curing accelerator. 【Proposing new value with low-temperature curing technology】 - Improved productivity through reduced manufacturing temperature and time. - Enables combinations that were previously unavailable, such as heat resistance of parts. - Reducing curing temperature decreases internal stress due to cooling shrinkage. - Achieves high adhesion and prevents cracking. Please also refer to our company website.

• Other polymer materials

★Are you facing any of these issues? 〇 Unable to apply solder due to the inclusion of heat-sensitive components 〇 Want to mount and join components on flexible substrates 〇 Looking to improve connection reliability between terminals (gold, copper, nickel, tin, etc.) The "Plain Set Conductive Type" is a conductive adhesive that balances conductivity and adhesion based on a low-temperature curing of 80°C. It excels in adhesion and crack resistance, and because it can cure at low temperatures, it can serve as an alternative to solder for electronic components that cannot withstand reflow or high curing temperatures due to heat resistance issues. By not using solder, it eliminates the need for flux cleaning, contributing to a reduction in processes. 【Features】 ■ Cures at a low temperature of 80°C ■ Can replace solder ■ Suppresses the increase in contact resistance with nickel and tin 【Exhibition Information】 Exhibition Name: High-Function Materials Week Adhesive Bonding EXPO Date: October 29 (Tuesday) to 31 (Thursday), 2024, 10:00 AM to 6:00 PM (ends at 5:00 PM on the last day) Venue: Makuhari Messe Booth Number: 15-27 *For more details, please refer to the PDF document or feel free to contact us. Also, please visit our website at the URL below.

• glue

★Are you facing any of these issues? 〇Solder cannot be applied due to the inclusion of heat-sensitive components. 〇I want to mount and join components on flexible substrates. 〇I want to improve connection reliability between terminals (such as gold, copper, nickel, tin). The "Plain Set Conductive Type" is a conductive adhesive that combines conductivity and adhesion based on low-temperature curing at 80°C. It suppresses galvanic corrosion, which is a common issue with conductive adhesives using silver powder, and excels in connection reliability with terminals such as nickel and tin. It can serve as an alternative to solder for electronic components that cannot undergo reflow or high curing temperatures due to heat resistance issues. Additionally, it eliminates the need for flux cleaning, contributing to process reduction. 【Features】 ■Curing at a low temperature of 80°C is possible. ■Can replace solder. ■Suppresses the increase in contact resistance with nickel and tin. *For more details, please refer to the PDF materials or feel free to contact us. Also, please visit our company website at the URL below.

• glue

★Are you facing any of these issues? 　〇Want to easily seal devices that are sensitive to moisture? 　〇Need to fill and seal gas inside components? 　〇Require materials with high moisture sealing properties? The "Plain Set Gas Barrier Type" is a low-temperature curing adhesive that has sealing functions in addition to adhesion. Thanks to our unique formulation technology, we have achieved a composition that makes it difficult for gas components such as water vapor to penetrate, contributing to the maintenance of the performance of applicable products. We solve concerns such as "wanting to easily seal devices that are sensitive to moisture" and "wanting to fill and seal gas inside components." 【Features】 ■ Enables frame-like sealing to protect devices from moisture and other elements. ■ Applicable for assembly purposes of devices that need protection from water vapor and other gases. ■ Allows for airtight sealing with gas encapsulation. *For more details, please refer to the PDF document or feel free to contact us. Also, please visit our company website at the URL below.

• glue
• Other polymer materials

★Are you facing any of these issues? 　〇 The adhesive area is small, and the adhesive part peels off or breaks during drop impact tests. 　〇 You want to significantly reduce vibrations and noise from motors, etc. 　〇 Different materials such as engineering plastics and metals do not bond well together. The "Plain Set Flexible Type" is a low-temperature curing adhesive that provides flexible bonding with high impact resistance and stress relaxation effects. Generally, epoxy resins have high strength and elasticity, but our unique formulation technology achieves a composition with low elasticity and flexibility. It solves problems such as "the adhesive part peels off or breaks" and "the vibrations and noise from motors are loud." 【Features】 ■ Cures at a low temperature of 80°C ■ Becomes a rubber-like elastomer after curing, providing effective flexibility for stress relaxation and shock/vibration absorption ■ As a low-elasticity material, it has high peel strength and is effective for bonding dissimilar materials with a large difference in linear expansion coefficients. *For more details, please refer to the PDF document or feel free to contact us. Also, please visit our company website at the URL below.

• glue
• Other polymer materials

★Are you facing any of the following issues? 　〇 Want to bond low heat-resistant parts at a low curing temperature 　〇 Want to relieve stress caused by heat 　〇 Want to achieve snap curing inline 'Plain Set' is a one-component epoxy resin adhesive developed based on the technology of latent curing agents that our company has accumulated over the years. It is utilized in various fields such as precision electronic components like camera modules, semiconductor mounting, communication components, and car electronics. We offer a lineup of products with unique features, including: "Flexible Type" "Gas Barrier Type" "UV and Heat Combined Type" "Conductive Type," among others, with their respective characteristics available in the catalog. 【Features】 ■ Suitable for assembling electronic components that include heat-sensitive materials due to its low-temperature curing capability of below 80°C ■ Can cure in just a few seconds at low temperatures of 120°C and 150°C ■ With a low thermal history, it alleviates stress caused by material contraction during cooling, suppressing warping and deformation *For more details, please refer to the PDF materials or feel free to contact us. Also, please visit our company website at the URL below.

• glue

The "Plain Set" is an industrial adhesive that can be utilized in various fields such as precision electronic components like camera modules, semiconductor mounting, and car electronics. This product was developed based on the technology of latent curing agents that our company has accumulated over the years. Since there is no waste from leftover usage like with two-component types, it contributes to the effective use of resources and waste reduction. 【Features】 ■ Single-component ■ Storage stability ■ Low-temperature curing ■ Fast curing ■ Wide range of lineup *For more details, please refer to the catalog or feel free to contact us.

• glue
• plastic