For those struggling with solder connections! A one-component conductive adhesive that can cure at low temperatures.
Conductive Type Sealing Material "Plain Set"
[Exhibition Participation] No need for reflow or flux cleaning! Reduction of processes and use of materials with low heat resistance is possible. "Plain Set - Conductive Type"
★Are you facing any of these issues? 〇 Unable to apply solder due to the inclusion of heat-sensitive components 〇 Want to mount and join components on flexible substrates 〇 Looking to improve connection reliability between terminals (gold, copper, nickel, tin, etc.) The "Plain Set Conductive Type" is a conductive adhesive that balances conductivity and adhesion based on a low-temperature curing of 80°C. It excels in adhesion and crack resistance, and because it can cure at low temperatures, it can serve as an alternative to solder for electronic components that cannot withstand reflow or high curing temperatures due to heat resistance issues. By not using solder, it eliminates the need for flux cleaning, contributing to a reduction in processes. 【Features】 ■ Cures at a low temperature of 80°C ■ Can replace solder ■ Suppresses the increase in contact resistance with nickel and tin 【Exhibition Information】 Exhibition Name: High-Function Materials Week Adhesive Bonding EXPO Date: October 29 (Tuesday) to 31 (Thursday), 2024, 10:00 AM to 6:00 PM (ends at 5:00 PM on the last day) Venue: Makuhari Messe Booth Number: 15-27 *For more details, please refer to the PDF document or feel free to contact us. Also, please visit our website at the URL below.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Alternative to solder ■ Die attach adhesive (thermal conductivity) ■ Electromagnetic wave shielding *For more details, please refer to the PDF document or feel free to contact us.
catalog(1)
Download All CatalogsCompany information
Ajinomoto Fine-Techno Co., Ltd. is a company that serves as the core of the fine chemical business within the Ajinomoto Group. Our main products include the ABF series of insulating materials and industrial adhesives and sealants known as Plain Set. We are highly regarded by our customers in the fields of electronic materials, functional materials, and activated carbon. Our products and services boast high reliability and quality, particularly utilizing cutting-edge technology in the electronic materials sector. In the functional materials field, we provide high-performance materials, and in the activated carbon sector, we are environmentally conscious. We will continue to provide high-quality products and services to the electronics and automotive industries. To deliver peace of mind and trust to our customers, we are committed to technological innovation and service improvement, and we sincerely listen to our customers' voices. At Ajinomoto Fine-Techno Co., Ltd., we value our trust-based relationships with customers and will contribute to the realization of a sustainable society. Please look forward to our efforts.

