ランテクノロジー List of Products and Services

In the electronic components industry, miniaturization and high density are advancing, increasing the importance of microfabrication technology. In particular, precise shapes and fine hole processing are critical factors that influence product performance and reliability. Traditional processing methods have limitations in accuracy and efficiency, which can lead to reduced yield and increased costs. The LTC6050 achieves high-level microfabrication with a minimum beam diameter of Φ10μm, contributing to the high quality of electronic components. 【Application Scenarios】 - Processing of fine metal parts such as shims, gaskets, and springs - Processing of etching materials - Processing from ultra-thin materials to thin plates 【Effects of Implementation】 - Improvement in product quality through high-precision processing - Increased productivity through reduced processing time - Expansion of product development possibilities by accommodating diverse materials

• Other processing machines

The "LTC6050" is an ultra-precision fiber laser processing machine specialized in fine processing from 0.01mm thin films to 2mm thick materials. It achieves ultra-fine metal processing within a processing area of 600mm² for items such as shims, gaskets, and springs. The footprint is also compact, measuring approximately 1.3m × 1m. It enables high-level fine processing with a minimum beam diameter of Φ10μm. 【Features】 ■ Equipped with an IPG 500W oscillator and Mitsubishi NC, ensuring reliable domestic design and manufacturing ■ Achieves high-level fine processing with a minimum beam diameter of Φ10μm ■ Capable of processing spring materials and etching materials ■ Can handle various processing tasks from ultra-thin materials to thin plates *For more details, please download the PDF or feel free to contact us.

• Other processing machines