ランテクノロジー Product Lineup

The "LTC6050" is an ultra-precision fiber laser processing machine specialized in fine processing from 0.01mm thin films to 2mm thick materials. It achieves ultra-fine metal processing within a processing area of 600mm² for items such as shims, gaskets, and springs. The footprint is also compact, measuring approximately 1.3m × 1m. It enables high-level fine processing with a minimum beam diameter of Φ10μm. 【Features】 ■ Equipped with an IPG 500W oscillator and Mitsubishi NC, ensuring reliable domestic design and manufacturing ■ Achieves high-level fine processing with a minimum beam diameter of Φ10μm ■ Capable of processing spring materials and etching materials ■ Can handle various processing tasks from ultra-thin materials to thin plates *For more details, please download the PDF or feel free to contact us.

In the electronic components industry, miniaturization and high density are advancing, increasing the importance of microfabrication technology. In particular, precise shapes and fine hole processing are critical factors that influence product performance and reliability. Traditional processing methods have limitations in accuracy and efficiency, which can lead to reduced yield and increased costs. The LTC6050 achieves high-level microfabrication with a minimum beam diameter of Φ10μm, contributing to the high quality of electronic components. 【Application Scenarios】 - Processing of fine metal parts such as shims, gaskets, and springs - Processing of etching materials - Processing from ultra-thin materials to thin plates 【Effects of Implementation】 - Improvement in product quality through high-precision processing - Increased productivity through reduced processing time - Expansion of product development possibilities by accommodating diverse materials

In the semiconductor industry, the demand for microfabrication technology is increasing due to the miniaturization and high performance of devices. Particularly in the manufacturing processes of wafers and chips, high-precision processing is a crucial factor that affects product quality and yield. Fine pattern formation, as well as precise cutting and drilling, are required, and even slight processing errors can lead to product defects. The LTC6050 achieves high-level microfabrication with a minimum beam diameter of Φ10μm, addressing these challenges in semiconductor manufacturing. 【Application Scenarios】 - Microfabrication of wafers - Cutting and drilling of chips - Precision machining of various metal parts 【Benefits of Implementation】 - Improved product quality through high-precision microfabrication - Enhanced yield - Compatibility with a variety of metal materials - Space-saving design due to compactness

In the medical device industry, the processing of precise metal components such as implants and surgical instruments is required. In particular, high-precision cutting is essential to ensure both safety and functionality. Conventional processing methods may face challenges such as burr generation and deformation due to heat. The LTC6050 achieves high-level microprocessing with a minimum beam diameter of Φ10μm, enabling high-quality component processing in medical device manufacturing. 【Application Scenarios】 - Cutting of implant components - Microprocessing of surgical instruments - Manufacturing of medical sensor components 【Benefits of Implementation】 - Improved product quality through high-precision cutting - Suppression of burr generation, leading to increased efficiency in subsequent processes - Minimization of thermal effects, maintaining material properties

In the electronic components industry, the miniaturization and high density of products are advancing, leading to a demand for fine marking. Accurate and high-quality marking is essential for component identification and tracking manufacturing processes. Traditional marking methods have limitations in precision and speed, which can lead to reduced yield rates. The LTC6050 achieves high-level fine processing with a minimum beam diameter of Φ10μm, enabling high-precision marking on electronic components. 【Application Scenarios】 - Marking model numbers and manufacturing lot numbers on electronic components - Marking component placement positions on circuit boards - Marking on various sensors and connectors 【Benefits of Implementation】 - Improved product quality through high-precision marking - Adaptation to miniaturization and high density of components through fine processing - Increased productivity through reduced marking time

In the jewelry industry, the beauty of design and the quality of products are important. In particular, meticulously crafted details in sculptures greatly influence the value of the products. Traditional processing methods can pose challenges in reproducing intricate designs and may damage the materials. The LTC6050 achieves high-level microfabrication with a minimum beam diameter of Φ10μm, enabling precise engraving for jewelry. 【Application Scenarios】 - Delicate pattern engraving on precious metals - Logo and text engraving on accessories - High-design jewelry production 【Benefits of Implementation】 - Increased product value through high-precision engraving - Improved reproducibility of intricate designs - Compatibility with a variety of materials

In the aerospace industry, reducing the weight of aircraft is essential for improving fuel efficiency and performance. Therefore, miniaturization and thinning of components are required. The LTC6050 contributes to the lightweighting of aerospace parts through microfabrication with a minimum beam diameter of 10μm and thin film processing capabilities starting from 0.01mm. 【Application Scenarios】 - Microfabrication of aircraft components - Precision machining of rocket parts - Prototyping of components aimed at weight reduction 【Effects of Implementation】 - Performance improvement through weight reduction of components - Quality enhancement through high-precision processing - Shortening of prototyping periods

In the automotive industry, mold manufacturing requires high precision and durability. The quality of molds directly affects the precision and performance of automotive parts, making fine processing technology essential. In particular, high precision and efficiency are required for fine groove processing and complex shape processing of molds. The LTC6050 achieves high-level fine processing with a minimum beam diameter of Φ10μm, addressing these challenges in mold manufacturing. 【Application Scenarios】 - Fine processing of molds - Processing of shims, gaskets, springs, etc. - Processing of etching materials 【Effects of Implementation】 - High-precision mold manufacturing - Production of high-quality automotive parts - Reduction of processing time

The watch industry is demanding diversification in design and high-quality decoration. In particular, delicate designs and the processing of complex shapes are important for enhancing the value of products. Fine decorations that were difficult to achieve with traditional processing methods can be realized with the LTC6050. 【Application Scenarios】 - Delicate pattern processing on watch dials - Logo and design engraving on watch cases - Precision cutting of decorative parts 【Benefits of Implementation】 - Increased design freedom - Enhanced product value through high-quality decoration - Shortened prototyping period

In the eyewear frame industry, there is a demand for diverse designs and high-quality finishes. In particular, precise processing of frame materials is essential to achieve both delicate designs and strength. Improper processing can lead to distortion of the frame and a decrease in strength. The LTC6050 enables high-level microprocessing with a minimum beam diameter of Φ10μm, supporting the high-quality manufacturing of eyewear frames. 【Application Scenarios】 - Cutting and drilling of titanium frames - Decorative processing of celluloid frames - Processing of composite frames made of metal and resin 【Benefits of Implementation】 - Improved quality through high-precision frame processing - Adaptation to diverse designs - Cost reduction through shortened processing times

In the smartphone component industry, miniaturization and high functionality are advancing, making the processing of precision metal parts essential. Particularly for components that require high precision within limited space, micro-machining technology significantly influences product performance. The LTC6050 achieves high-level micro-machining with a minimum beam diameter of Φ10μm, contributing to the improvement of smartphone component quality. 【Application Scenarios】 * Precision part processing inside smartphones * Processing of small connectors, shield cases, etc. * Manufacturing of parts that achieve thinness and lightweight 【Effects of Implementation】 * Improvement in product quality through high-precision part processing * Increased yield * Enhanced design flexibility

In prototype development at research institutions, precise machining of metal parts, which affects the accuracy of experiments, is essential. Particularly in the research of new materials and the prototyping of fine structures, high precision and diverse machining capabilities are required. Conventional machining methods often incur time and costs that can hinder research progress. The LTC6050 achieves high-level fine machining with a minimum beam diameter of Φ10μm, contributing to the efficiency of prototyping in research and development. 【Usage Scenarios】 - Research and development of new materials - Prototyping of fine structures - Prototyping of precision parts - Shape modification during the prototyping stage 【Benefits of Implementation】 - Improved research outcomes through high-precision prototyping - Reduced prototyping time - Lower machining costs - Compatibility with a variety of metal materials

In the dental technology industry, there is a demand for high quality and precise finishing of prosthetics. In particular, prosthetics such as implants and crowns significantly affect the fit in the patient's oral cavity and long-term stability, making high-precision processing essential. Inadequate processing can lead to patient discomfort and treatment failure. The LTC6050 achieves high-level micro-processing with a minimum beam diameter of Φ10μm, enabling precise processing of prosthetics. 【Application Scenarios】 - Implant superstructures - Crowns, bridges - Precision model production 【Effects of Introduction】 - Improved fit accuracy of prosthetics - Reduced treatment time - Increased patient satisfaction

In the mold industry, the precision of micro-hole processing, which affects product quality, is crucial. In particular, high-precision molds significantly impact the durability and performance of products. Traditional processing methods face challenges in accuracy and efficiency, which can hinder the production of high-quality products. The LTC6050 achieves high-level micro-processing with a minimum beam diameter of Φ10μm, addressing the challenges in micro-hole processing for molds. 【Application Scenarios】 - Micro-hole processing for molds - Processing of shims, gaskets, springs, etc. - Processing from ultra-thin materials to thin plates 【Benefits of Implementation】 - Improved product quality through high-precision micro-hole processing - Increased productivity due to reduced processing time - Expanded processing range by accommodating various materials