LTC6050 Ultra-Precision Laser Processing Machine for Electronic Components

Marking electronic components with a 10μm beam diameter. Reliability from domestic design and manufacturing.

In the electronic components industry, the miniaturization and high density of products are advancing, leading to a demand for fine marking. Accurate and high-quality marking is essential for component identification and tracking manufacturing processes. Traditional marking methods have limitations in precision and speed, which can lead to reduced yield rates. The LTC6050 achieves high-level fine processing with a minimum beam diameter of Φ10μm, enabling high-precision marking on electronic components. 【Application Scenarios】 - Marking model numbers and manufacturing lot numbers on electronic components - Marking component placement positions on circuit boards - Marking on various sensors and connectors 【Benefits of Implementation】 - Improved product quality through high-precision marking - Adaptation to miniaturization and high density of components through fine processing - Increased productivity through reduced marking time

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