LTC6050 for smartphone components

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Ultra-precision compact fiber laser processing machine 'LTC6050'

last updated：Apr 08, 2026

ランテクノロジー

Improving the quality of smartphone components with 10μm precision machining.

In the smartphone component industry, miniaturization and high functionality are advancing, making the processing of precision metal parts essential. Particularly for components that require high precision within limited space, micro-machining technology significantly influences product performance. The LTC6050 achieves high-level micro-machining with a minimum beam diameter of Φ10μm, contributing to the improvement of smartphone component quality. 【Application Scenarios】 * Precision part processing inside smartphones * Processing of small connectors, shield cases, etc. * Manufacturing of parts that achieve thinness and lightweight 【Effects of Implementation】 * Improvement in product quality through high-precision part processing * Increased yield * Enhanced design flexibility

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**Features** * Equipped with IPG500W oscillator and Mitsubishi NC, reliable domestic design and manufacturing * Achieves high-level fine processing with a minimum beam diameter of Φ10μm * Capable of processing spring materials and etching materials * Can handle various processing from ultra-thin materials to thin plates **Our Strengths** Lantechnology Co., Ltd. provides maintenance, installation, and repair services for laser processing machines. Our experienced staff supports your machinery, and with our unique system management, we ensure rapid response even in emergencies. We are available to assist you anywhere in the country.