カミツ List of Products and Services

The ceramic rolls manufactured by our company are used for processing and polishing printed circuit boards built into mobile phones, computers, digital cameras, and more. This new polishing material has grinding power that far surpasses the non-woven fabric rolls traditionally used for printed circuit board polishing, as well as a precise grinding surface. Currently, it is not limited to just printed circuit board polishing but is also utilized in various other fields. Our product has the following features compared to conventional polishing materials: 【Features】 ■ Incredible grinding power ■ High line speed ■ No hole bleeding due to polishing ■ Consistent surface roughness throughout ■ Minimal large polishing debris, and it is less likely to clog small diameter holes *For more details, please refer to the PDF document or feel free to contact us.

• Other abrasives

Ceramic rolls are the latest polishing material that far surpasses the grinding power and precision grinding surface of the non-woven fabric rolls traditionally used for printed circuit board polishing. They are currently utilized not only for printed circuit board polishing but also in various other fields. They polish large protrusions and hard inks with a powerful grinding force that conventional rolls do not possess. There is absolutely no hole bleeding regardless of the size of the holes, and the ink surface finishes flat. They are also effective for polishing metal pastes. 【Features】 - Deburring polishing after drilling - Removal of roughness after plating and leveling - Removal of prepreg resin after IVH board pressing - Leveling of resin in build-up resin boards and resin-coated boards - Leveling of plating height for active boards and plated bumps There is no copper dragging due to polishing, enabling the formation of fine line patterns. *For more details, please download the PDF or feel free to contact us.

• Other abrasives

- Deburring and polishing after hole drilling - Removal of surface irregularities and leveling after plating - Removal of prepreg resin after IVH substrate pressing - Leveling of resin on build-up resin substrates and resin-coated substrates - Leveling of plating height on active substrates and plated bumps 【Features】 ■ Improved production efficiency due to increased line speed ■ Excellent leveling properties for substrate surfaces, achieving a smooth finish ■ No hole bleeding due to polishing, resulting in a clean finish with minimal scratches *For more details, please download the PDF or feel free to contact us.

• Other abrasives

The ceramic rolls manufactured by Kamitsu, a pioneer in ceramic rolls, are used for processing and polishing printed circuit boards built into mobile phones, computers, digital cameras, and more. These latest polishing materials possess grinding power that far exceeds that of the non-woven fabric rolls traditionally used for printed circuit board polishing, as well as precision grinding surfaces, and are currently being utilized in various other fields as well. 【Features】 ■ Improved production efficiency due to increased line speed ■ Excellent leveling of the substrate surface, achieving a smooth finish ■ No hole bleeding from polishing and minimal scratches, resulting in a clean finish *For more details, please download the PDF or feel free to contact us.

• Other abrasives