新菱 List of Products and Services

Low heat-resistant materials have issues of "distortion, misalignment, and reduced characteristics" due to the heat during implementation (reflow). With the newly developed low-melting-point solder plating, the melting point can be selected in the low temperature range of 60 to 110°C to match the heat resistance of the target materials. This allows for implementation without damage or alteration. <Examples of applications> - PZT (piezoelectric elements) - CdTe (cadmium telluride) - Resin materials (such as PET) - micro LED (LTPS) etc... for implementation solder.

• Wafer
• Sensors
• EMS

We perform cleaning (regeneration) of special wafers. The targets include "fixture wafers" such as those with recessed shapes, as well as "special material wafers" made of alumina, quartz, SiC, AlN, and others. We can suggest cleaning methods tailored to your specific applications. Please feel free to consult us about cleaning various types of wafers. 【Overview】 ■Targets ・Fixture wafers: recessed shapes, etc. (Material: Si) ・Special material wafers: alumina, quartz, SiC, AlN, etc. ■Supported size: 12 inches ■Cleaning details ・Removal of contaminants (metal films, organic substances) ・Reduction of metal impurities (5×E10 to 1×E12 atoms/cm2 range) *For more details, please refer to the PDF document or feel free to contact us.

• Other contract services

From prototype to mass production of cutting-edge fine pitch bump plating, we possess various plating technologies including the three-component system. Since the RoHS directive, we have quickly engaged in the development of SnAgCu three-component alloy plating (lead-free plating) and have successfully commercialized it. 【Technical Details】 ■ Miniaturization ■ Narrow pitch ■ Precision ■ High functionality *For more details, please download the PDF or feel free to contact us.

• Processing Contract