コンガテックジャパン List of News Articles

congatec announces the acquisition of the module product business of Kontron AG. This includes JUMPtec GmbH, a pioneer in standardized computer-on-modules based in Deggendorf, as well as Kontron America Modules LLC and Kontron Asia Embedded Design Sdn. Bhd. This acquisition will further strengthen congatec's global presence and market leadership in standardized computer-on-modules. For the full press release, visit: https://www.congatec.com/jp/congatec/press-releases/article/computer-on-module-market-leader-invests-in-com-pioneer/

The "Product Highlights 2025 Japanese Version," covering Congatec's main products, has been completed! It includes products for embedded computing and edge computing, such as the standard form factors of Computer-on-Module (COM) / System-on-Module (SoM) like the PICMG standards COM Express and COM-HPC, SGET standards Qseven and SMARC, dedicated cooling solutions for these, and application-ready aReady. It features processors from high-performance x86-based Intel and AMD, as well as products equipped with Arm-based NXP and TI processors. We hope this will assist you in selecting products for your next-generation projects. Please download it from the link below. https://mono.ipros.com/company/detail/2063635/catalog/

Congatec has announced the expansion of its collaboration with Kontron, a global leading supplier of IoT technology, by adding Kontron to its existing computer-on-module (COM) manufacturing partners. This collaboration will be a key element of Congatec's "local production for local consumption" approach to improve efficiency in response to rising customer demand driven by changes in international trade and geopolitical factors. The full press release can be found here: https://www.congatec.com/jp/congatec/press-releases/article/congatec-extends-its-global-manufacturing-capacity-with-kontron-cooperation/

congatec, a leading provider of embedded and edge computing technology, has unveiled a heat pipe cooling solution for harsh environmental conditions at embedded world 2025, currently being held in Nuremberg, Germany. The new cooling solution uses acetone instead of water as the working fluid in the heat pipe. This prevents the thermal conduction medium from freezing even in extreme sub-zero temperature environments, thereby protecting the cooling solution, modules, and the entire system from damage. The new cooling solution is also unaffected by mechanical stresses such as shock and vibration. For the full press release, click here: https://www.congatec.com/jp/congatec/press-releases/article/congatec-heat-pipe-cooling-solution-for-extreme-environmental-conditions/

Congatec, a leading provider of embedded and edge computing technologies, enhances AI performance for medical, robotics, industry, retail, and gaming applications to up to 99 TOPS (Tera Operations per Second). This outstanding AI performance is delivered by the new conga-TC750 computer-on-module (COM) in the COM Express Compact Type 6 form factor, which features the Intel Core Ultra Series 2 processor (codename Arrow Lake) with up to 16 cores, 22 threads, and GPU and NPU, powered by the "Lion Cove" P cores and "Skymont" E cores. Full press release here: https://www.congatec.com/jp/congatec/press-releases/

congatec, a leading provider of embedded and edge computing technology, expands the application-ready capabilities of aReady.COM to aReady.IOT by introducing powerful software building blocks for secure IoT connectivity from computer-on-modules (COM) to the cloud. This further simplifies the utilization of the latest embedded applications and accelerates innovation. With aReady.IOT, congatec enables seamless communication and data transfer between multiple systems and devices, reducing the complexity of application development, allowing users to fully focus on their core competencies. congatec offers the necessary software building blocks in the desired combinations for immediate use. For the full press release, visit: https://www.congatec.com/jp/congatec/press-releases/article/congatec-launches-areadyiot/

The website of Congatec features a blog (in English) by experts in embedded computing and edge computing. The Japanese translations are published periodically on the following site: https://www.incom.co.jp/corporation/custom.php?company_id=4735&custom_page_id=631 The 10th installment is about the conga-TCR8 module equipped with AMD Ryzen Embedded 8000, which won the "Embeddy Award." Check out the highlights of products for edge AI. 【Currently Published Blogs】 1. COM-HPC Mini - Part 1: Size 2. COM-HPC Mini - Part 2: Pinout : 7. COM-HPC Mini - Part 3: Cooling : 10. From an Unsung Hero to an Award-Winning Star: Spotlight on Congatec's conga-TCR8 We hope this will be helpful for your embedded system development and new projects.

congatec, a leading provider of embedded and edge computing technologies, has expanded its portfolio of high-performance COM-HPC Computer-on-Modules (COM) with the conga-HPC/cBLS, specifically developed for applications that require high performance, such as edge and infrastructure. The new COM-HPC Client Size C (120x160 mm) module is based on Intel's Core S processor (codename Bartlett Lake-S) performance hybrid architecture, featuring up to 16 efficient cores (E-core) and up to 8 performance cores (P-core), supporting up to 32 threads. This module is designed for demanding applications requiring multi-core and multi-threaded performance, large cache, vast memory capacity, high bandwidth, and evolving I/O technologies. For the full press release, click here: https://bit.ly/3E1RNbo

Congatec, a leading provider of embedded and edge computing technology, is expanding its conga-SA8 SMARC module. The low-power computer-on-module (COM) will now feature the latest Intel Core i3 processors. This new CPU technology significantly enhances performance, making the energy-efficient credit card-sized SMARC module ideal for integration into high-performance edge applications and low-power systems. The new conga-SA8 model delivers higher performance and improved energy efficiency for all edge computing applications operating in an extended temperature range of 0°C to +60°C. Read the full press release here: https://bit.ly/4jjHIXA