ミクロ技研 List of Products and Services

Our company has primarily focused on semiconductor manufacturing equipment, but we are applying our know-how in semiconductor manufacturing to expand our business into medical devices, healthcare products, automotive-related products, and aerospace-related products. Currently, we support our client companies in solving their challenges with a wide range of products based on core technologies such as cleaning technology, grinding and polishing technology, R to R technology, coating technology, chemical processing technology, and printing technology. Additionally, we have established core technologies in areas such as appearance inspection technology, FA technology, and environmental technologies represented by ultra-fine bubbles, and we are advancing the further enhancement of our technical capabilities and product development. Since the establishment of the ME Group in 2019, we obtained approval for medical device manufacturing and sales in 2020 and have newly started the manufacturing and sales business for healthcare products in 2021. *For more details, please refer to the PDF document or feel free to contact us.

• Contract manufacturing

"CIRCULA" is a suction-type hand dryer that minimizes the scattering of water droplets and bacteria. It suppresses 99.9% of collected bacteria using a HEPA filter combined with the effect of copper ions. The blown air is suctioned back in, preventing water droplets from scattering and allowing for circulation. Additionally, it is equipped with a powerful yet quiet motor made by Nidec. 【Features】 ■ Minimizes the scattering of water droplets and bacteria ■ Hygienic with a combination of HEPA filter and copper fibers ■ Equipped with a powerful and quiet motor made by Nidec ■ Uses antibacterial material from Teijin in the main body *For more details, please refer to the PDF document or feel free to contact us.

• Other safety and hygiene products

The "CMG-802XJ" is a fully automated wafer grinding and polishing composite device that places four vacuum chucks on a sorting table and processes in sequence: chuck surface cleaning, rough grinding, finishing grinding, and polishing, using a rotary transfer type. It was newly developed in response to the high-precision downsizing demands for a wide variety of IC cards and SiP products. With an integrated mechanism with the MDS (Tape Mounting and Peeling Device), it provides a total solution for damage-free processing and ultra-thin wafer thickness. 【Features】 ■ Supports 300mm ultra-thin wafers ■ Integrated mechanism with MDS (Tape Mounting and Peeling Device) ■ Provides total solutions for damage-free processing and ultra-thin wafer thickness ■ Capable of grinding 8-inch/12-inch wafers down to a thickness of 30μm ■ Automatically performs chuck surface cleaning, rough grinding, finishing grinding, and polishing all in one machine *For more details, please refer to the PDF document or feel free to contact us.

• Wafer processing/polishing equipment

The "MGP-808XJ" is a fully automatic CMP device that is the successor to the Lap Master SFT's "LGP-808XJ." It adopts a newly developed head by our company, achieving improvements in GBIR and SFQR on the wafer surface. The transport method is either edge clamp or edge contact. Additionally, it allows for dry in/dry out capabilities through integration with a cleaning machine. 【Features】 ■ Successor model to the Lap Master SFT's "LGP-808XJ" ■ Achieves improvements in GBIR and SFQR on the wafer surface ■ High throughput with 8 polishing heads and 3 polishing plates ■ All transport systems use either edge clamp or edge contact methods ■ Allows for dry in/dry out capabilities through integration with a cleaning machine *For more details, please refer to the PDF document or feel free to contact us.

• CMP Equipment

Micron Technology Co., Ltd. is engaged in the development, manufacturing, and sales of various electronic materials such as silicon wafers, FPD panels, and films, as well as automatic inspection equipment. With core technologies in cleaning, grinding and polishing, roll-to-roll technology, coating, chemical processing, and printing, we support our customers in solving their challenges through a wide range of product offerings. In the future, we will establish new core technologies such as appearance inspection technology, FA technology, and environmental technologies represented by ultra-fine bubbles, further enhancing our technical capabilities and advancing product development. 【Business Objectives】 ■ Development, manufacturing, and sales of manufacturing equipment for various electronic materials (silicon wafers, FPD panels, films, etc.) ■ Development, manufacturing, and sales of automatic inspection equipment *For more details, please download the PDF or contact us.

• Wafer processing/polishing equipment