日本アルミット Product Lineup

We would like to introduce our high-performance halogen-free solder, 'DB-ZERO.' This product complies with J-STD-004C ROL0. It improves the quality of solder on through-holes required for automatic machine point placement. Additionally, it allows for a reduction in cleaning labor associated with the occurrence of solder spikes. Please feel free to contact us if you have any inquiries. 【Features】 ■ Measures for through-hole quality ■ Halogen-free ROL0 ■ Measures for solder spikes *For more details, please refer to the PDF document or feel free to contact us.

• Solder

The "LFM-48 NH-GE(H)" is a dual boost solder paste that achieves the wettability equivalent to ROL1 while maintaining high reliability of non-halogen paste. It adopts the new technology "Dual Boost," which solves various issues associated with non-halogen paste. This is a unique technology from Almit that combines both fast and slow activation. Even under stringent reflow conditions such as atmospheric reflow and long preheating, it demonstrates melting properties that non-halogen pastes typically lack. 【Features】 ■ High reliability under high temperature and sealed environments ■ Reduction of BGA pillow defects ■ Good melting properties for micro solder joints ■ Reduction of voids *For more details, please refer to the PDF document or feel free to contact us.

• Solder

We would like to introduce our resin-containing solder, 'DB1-RMA'. It offers excellent through-hole performance thanks to "Dual Boost." The combination of two types of activators achieves both fast initial wetting and effective wetting in through-holes. It is compatible with oxidized substrates after reflow and suppresses flux spattering. 【Features】 ■ Excellent through-hole performance with "Dual Boost" ■ Compatible with oxidized substrates after reflow ■ Suppresses flux spattering ■ RMA, JIS-AA grade, and J-STD-ROL1 flux reliability *For more details, please refer to the PDF document or feel free to contact us.

• Solder

The "LFM-H Series" is a solder containing antioxidants that achieves "reduction of oxidation dross on the surface of molten solder" and "reduction of solder ball scattering" due to the effects of the antioxidants. We offer a lineup of SAC305, Sn-Cu-based, and copper erosion-resistant alloys. Please feel free to contact us if you have any requests. 【Features】 ■Significantly suppresses the generation of oxidation dross ■Reduces the occurrence of solder balls during dipping *For more details, please download the PDF or feel free to contact us.

• Solder

"SR-HS" is a solder that supports through-hole soldering and allows for high-speed and stable soldering. When soldering to through-hole PCBs, it ensures stable wetting on the back side of the land. Additionally, the spread of flux residue is stable, suppressing interference from flux residue around the soldered area. [Features] ■ Enables high-speed and stable soldering ■ Suppresses flux scattering ■ Compatible with alloys that prevent solder tip erosion *For more details, please download the PDF or feel free to contact us.

• Solder
• Other metal materials