埼玉プレーナー工業所 Product Lineup

Proposal for Use Our company is engaged in large metal processing, but we have been troubled by the handling of metal shavings generated during processing. In particular, removing shavings that get lodged in the "T-slot" used to secure the workpiece takes a lot of effort and time. By covering and sealing only the T-slot, we have completely prevented the intrusion of shavings, resulting in a significant improvement in productivity (reducing the time for removing cutting debris to one-third).

• Other cleaning tools
• Processing Jig
• Milling machine

Our "gantry machining center" equipment has a gate width of 2100mm, allowing for the processing of large sputtering targets for semiconductors (over Φ660mm) and for LCD manufacturing (up to 2000x4000mm). Additionally, it features NC control with multi-axis AI correction capabilities, ensuring high repeatability and enabling the use of 3D measurement functions on the machine to guarantee the precision of processed products for all units. It is suitable for processing lots of approximately 1000 pieces per month. Furthermore, we have built a track record of processing various materials such as tin, aluminum, and copper in collaboration with multiple partner factories. 【Examples of Implementation】 ■ Silver sputtering target cutting processing ■ Copper sputtering target cutting processing (6N) ■ Tin sputtering target cutting processing (6N) - All measurement data attached - Mass production support - Degreasing, packaging, and nationwide transportation support *For more details, please visit our website or feel free to contact us.

• Processing Contract
• Contract manufacturing
• Other semiconductor manufacturing equipment

Our company specializes in precision machining of bases (platforms) for machine tools and paper-making machines, as well as large components used in these machines and parts for semiconductor manufacturing equipment. In particular, we can handle strict dimensional tolerances with difficult-to-machine materials such as heat-resistant alloys like Hastelloy, Inconel, and SUS304, which are widely used in semiconductor manufacturing equipment. We also utilize 3D CAD/CAM and simulations to ensure high-efficiency cutting. If you are facing challenges with large-scale machining or difficult-to-machine workpieces, please feel free to consult us. 【Features】 ■ Multiple machining centers equipped with high-torque spindles ■ Capable of meeting strict dimensional tolerances with difficult-to-machine materials ■ Utilizing 3D CAD/CAM and simulations for high-efficiency cutting *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Contract manufacturing
• Other semiconductor manufacturing equipment