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"Yupicel(R) H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. 【Features】 ■ Ultra-thin heat dissipation substrate material ■ Super lightweight heat dissipation substrate material ■ Roll processing through a unique continuous manufacturing method ■ Three-dimensional processing capability ■ Halogen-free, UL94V-0 certified (E319042) (Contains no ceramic fillers, has good machinability, suitable for bare chip mounting COB) *For more details, please download the PDF or feel free to contact us.
