By reducing the thickness of the insulation layer, high heat dissipation can be achieved! Ultra-thin heat dissipation substrate material.
"Yupicel(R) H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. 【Features】 ■ Ultra-thin heat dissipation substrate material ■ Super lightweight heat dissipation substrate material ■ Roll processing through a unique continuous manufacturing method ■ Three-dimensional processing capability ■ Halogen-free, UL94V-0 certified (E319042) (Contains no ceramic fillers, has good machinability, suitable for bare chip mounting COB) *For more details, please download the PDF or feel free to contact us.
Inquire About This Product
basic information
【Shipping Information】 ■Roll Shipment: Width 510mm × Length 100mm ■Sheet Shipment: 510mm × 610mm, etc. *For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ For LED heat dissipation ・LED backlight units ・LED lighting ・Automotive LED units ■ For power modules ・Inverters ・Power supply units *For more details, please download the PDF or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Bids Solution Co., Ltd. is a trading company specializing in technology related to printed circuit boards, providing solution business to set manufacturers and board manufacturers in Japan, China, and ASEAN. Specifically, we conduct design and prototyping with short lead times domestically, and connect that information with our overseas partner factories through our system, delivering products to both domestic and overseas set manufacturers in a seamless business process. We handle a variety of boards, including single-sided, silver/copper through-hole up to 30 layers, build-up, package, and flexible boards. Please feel free to consult us about any type of board.