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  6. Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

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last updated:Dec 07, 2023

宇部エクシモ
宇部エクシモ
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Ultra-thin, lightweight heat dissipation substrate without adhesive type! Since three-dimensional processing is possible, substrates of various shapes can be produced!

Ube Eximo's "Yupisel H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. It is characterized by its ability to be three-dimensionally processed, making it a suitable material for LEDs and power modules. 【Features】 ■ It is an ultra-thin and super-lightweight heat dissipation substrate material. ■ It allows for three-dimensional processing, enabling the production of substrates in various shapes. ■ Roll processing is possible due to a unique continuous manufacturing method. ■ It does not use halogens. ■ It contains no ceramic fillers, providing excellent machinability. ■ It is suitable for bare chip mounting COBs. *For more details, please request materials or view the PDF data available for download.

    aluminum
キャプチャ.PNG

Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

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キャプチャ.PNG

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【General Characteristics】 ■ Peel Strength ・Normal Condition: 1.5N/mm ・85℃/85%RH, 1000 hours: 1.5N/mm ■ Insulation Breakdown Voltage: Measured value at 25μmt 7.0kV ■ Flame Resistance: UL94 measured value V-O *For more details, please refer to the PDF document or feel free to contact us.

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【Applications】 ■ For LED heat dissipation ・LED backlight units ・LED lighting and automotive LED units ■ Power module type ・Inverters ・Power supply units *For more details, please refer to the PDF document or feel free to contact us.

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Polyimide metal-based heat dissipation substrate material "Yupicel H"

Polyimide metal-based heat dissipation substrate material "Yupicel H"

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宇部エクシモ

宇部エクシモ

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Ube Eximo (renamed on October 1, 2013; formerly Ube Nitto Kasei) has been a member of the Ube Industries Group since its establishment in 1966, delivering a variety of products to the world. Our lineup includes essential materials for optical communication cables, spacers for liquid crystal displays, flexible copper-clad laminates, and FRP products that enjoy strong support in the agriculture, fisheries, and construction sectors. We also offer plastic cardboard widely used across various industrial fields and high-strength polypropylene fibers that are indispensable for improving the performance of secondary batteries, boasting a level of recognition that makes them known to all in their respective fields. The source of these products lies in our unwavering commitment to responding to our customers' desires for "what would be nice to have," which has driven our continuous improvement in technical capabilities and relentless research and development. We aim to continue this spirit without wavering, focusing on creating new value by leveraging our unique technologies.

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