宇部エクシモ Product Lineup

The "Compose(R) Pipe" is an extremely lightweight FRP scaffolding material, weighing about half that of a single pipe. It allows for a reduction in work time for assembly, disassembly, and lifting, as well as significant savings in transportation costs, and contributes to CO2 reduction due to decreased loading weight during transport. Additionally, it produces low noise during loading, unloading, assembly, and disassembly, so there are no concerns about noise during work in urban areas or at night. 【Features】 ■ Extremely lightweight ■ Longer lasting compared to wood ■ Safe and efficient for work ■ Non-conductive ■ No electric sparks generated, etc. *For more details, please download the PDF or feel free to contact us.

• Work tools

"Compose Bata(R)" is an FRP construction formwork column material made with UEXC's unique technology, featuring a lightweight and strong three-layer structure with special resin adhesion. It is highly resistant to water and seawater, with no concerns about rust, making it suitable for marine civil engineering. Additionally, it has excellent electrical insulation properties, eliminating worries about electric leakage accidents. 【Features】 ■ Weighs about half that of steel pipe bata, extremely lightweight ■ Reduces work time for assembly, disassembly, and lifting ■ Significantly reduces transportation costs ■ Relatively easy to detach concrete and slurry ■ Concrete and slurry do not flow into the pipe due to sealed ends, etc. *For more details, please download the PDF or feel free to contact us.

• Other work tools

Ube Eximo's "Yupisel H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. It is characterized by its ability to be three-dimensionally processed, making it a suitable material for LEDs and power modules. 【Features】 ■ It is an ultra-thin and super-lightweight heat dissipation substrate material. ■ It allows for three-dimensional processing, enabling the production of substrates in various shapes. ■ Roll processing is possible due to a unique continuous manufacturing method. ■ It does not use halogens. ■ It contains no ceramic fillers, providing excellent machinability. ■ It is suitable for bare chip mounting COBs. *For more details, please request materials or view the PDF data available for download.

• aluminum

High Presica is a microparticle synthesized from high-purity silicon compounds. There are hard silica particles that excel in load resistance and soft organic-inorganic hybrid particles that do not scratch delicate substrates. The characteristics of High Presica include a very uniform particle size (monodisperse), a nearly spherical shape, and extremely high purity. Leveraging these features, it is used as a spacer in liquid crystal displays (LCDs) to maintain a uniform thickness of the cell containing the liquid crystal material, making it an essential component for enhancing LCD resolution. Additionally, it is used in various fields such as spacers for adjusting adhesive layer thickness, high-performance resin fillers (for semiconductor encapsulation materials, among others), and particles for high-performance film coatings. *For more details, please download the catalog.*

• Glass