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We would like to introduce a case where our proposal led to the reduction of unnecessary processes and resources related to materials and plating treatment. As background, in the insert molding and assembly processes, we had to cut and discard part of the terminals to secure the necessary workspace. As a result, despite the terminals not being used, costs for materials and plating treatment were incurred, leading to higher manufacturing and plating costs than necessary. Therefore, we proposed a method to transfer the terminals to a different transport band after plating and re-crimp them in a manner suitable for the conditions of the subsequent process. This significantly contributed to the reduction of manufacturing and plating costs. **Features** - **Challenges** - Costs for materials and plating treatment were incurred despite the terminals not being used. - **Effects** - Achieved approximately 40% cost reduction compared to conventional methods. - Reduction of unnecessary processes and resources related to materials and plating treatment. - Enabled flexible responses to space constraints in insert molding and assembly processes. *For more details, please download the PDF or feel free to contact us.*